Transgranular Crack Propagation in Thermal Cycling of SnAgCu Solder Joints

2019 ◽  
Author(s):  
Andreas Lovberg ◽  
Per-Erik Tegehall
Keyword(s):  
Crack Propagation ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Snagcu Solder ◽  
Transgranular Crack

Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part II — Crack Propagation

2003 ◽  
Author(s):  
Donghyun Kim ◽  
Andrew Mawer ◽  
Glenn Y. Masada ◽  
Tess J. Moon
Keyword(s):  
Crack Propagation ◽  
Crack Growth ◽  
Solder Joints ◽  
Propagation Model ◽  
Modeling And Analysis ◽  
Snagcu Solder ◽  
Secondary Cracks ◽  
Aging Conditions ◽  
Length Data ◽  
Crack Growth Rates

Part II of this paper describes an experimental and analytical study of crack propagation in SnPb and SnAgCu solder joints in 357-PBGA packages exposed to 30-minute thermal cycles of 0 to 100°C. Experimental results show that cracks propagate faster at the package interface than at the board interface; secondary cracks from at the package interface, but grow much slower than the primary cracks; and crack growth rates in SnPb joints are about 50% larger than in SnAgCu joints. A crack propagation model, developed using the fracture mechanics approach, calculates the energy release rate at the crack tip. Using this rate and experimental crack length data, crack propagation rates were computed. Simulation results show the effects of solder type and aging conditions on crack propagation rates and the effects of the number of cracks in a joint on crack propagation life.

Effects of Thermal Cycling on Creep of SnAgCu Solder Joints

2019 ◽  
Vol 9 (5) ◽  
pp. 888-894 ◽  
Author(s):  
T. Alghoul ◽  
L. Wentlent ◽  
R. Sivasubramony ◽  
C. Greene ◽  
P. Thompson ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Snagcu Solder

An Empirical Crack Propagation Model and its Applications for Solder Joints

1996 ◽  
Vol 118 (2) ◽  
pp. 104-107 ◽  
Author(s):  
Jimmy M. Hu
Keyword(s):  
Fracture Mechanics ◽  
Crack Propagation ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Propagation Model ◽  
Engineering Method ◽  
Thermal Cycling Test ◽  
Creep Effect ◽  
Different Temperatures ◽  
Validation Tests

This paper investigates a strain based crack propagation model, and discusses the application of fracture mechanics approach in the reliability validation of leadless solder joints. The model includes the creep effect at different temperatures and hold times, and correlates well the thermal cycling test of 90 Pb/10 Sn joints. By apply this model, an engineering method to develop the inspection criteria in accelerated reliability validation tests of leadless solder joints is proposed.

A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling

1990 ◽  
Vol 112 (2) ◽  
pp. 104-109 ◽  
Author(s):  
Boon Wong ◽  
D. E. Helling
Keyword(s):  
Crack Initiation ◽  
Solder Joint ◽  
Crack Propagation ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Mechanistic Model ◽  
Propagation Model ◽  
Time To Failure ◽  
Surface Mount ◽  
Life Predictions

A mechanistic model for eutectic Pb/Sn solder life predictions has been developed and applied to leadless surface mount solder joints. This model can quantitatively describe both crack initiation and crack propagation processes in the solder. There are four parts to this model: a crack initiation model, a crack propagation model [1], a microstructural coarsening model and an analysis of the deformation in the solder during thermal cycling. By merging these models together, it is possible to predict the time to crack initiation and the time to failure of these solder joints. Solder joint life predictions show good agreement with data obtained on thermally cycled surface mount leadless chip resistors.

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