Meeting thermal performance and reliability challenges for a thermally enhanced ball grid array package (TEBGA)

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4606945 ◽

2008 ◽

Author(s):

Quan Qi

Keyword(s):

Thermal Performance ◽

Ball Grid Array ◽

Ball Grid Array Package

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Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA

Microelectronics International ◽

10.1108/13565369810215609 ◽

1998 ◽

Vol 15 (2) ◽

pp. 25-33 ◽

Author(s):

John H. Lau ◽

K.L. Chen ◽

F. Wu

Keyword(s):

Thermal Performance ◽

Low Cost ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Development of improved thermal performance embedded heat slug plastic ball grid array package

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216493 ◽

2004 ◽

Author(s):

B.A. Zahn ◽

F. Carson ◽

T.K. Lee ◽

R. Coronado ◽

D. Mitchell

Keyword(s):

Thermal Performance ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Thermal performance of an air-cooled plastic ball grid array package in natural and forced convection

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689516 ◽

2002 ◽

Author(s):

K. Ramakrishna ◽

T.R. Thomas ◽

T.Y. Tom Lee ◽

J.R. Trent ◽

J.V. Hause

Keyword(s):

Forced Convection ◽

Thermal Performance ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507785 ◽

2008 ◽

Author(s):

Victor Lim ◽

Ibrahim Ahmad ◽

Foong Chee Seng ◽

Nowshad Amin ◽

Rozaidi Rasid

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Catalytic Activation ◽

Heat Spreaders ◽

Ball Grid Array Package

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A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.926382 ◽

2001 ◽

Vol 24 (2) ◽

pp. 191-198 ◽

Author(s):

S. Shidore ◽

V. Adams ◽

T.T. Lee

Keyword(s):

Thermal Model ◽

Flip Chip ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Ceramic ball grid array package stress analysis

10.1063/1.5002485 ◽

2017 ◽

Author(s):

S. H. B. S. Badri ◽

M. H. A. Aziz ◽

N. R. Ong ◽

Z. Sauli ◽

J. B. Alcain ◽

...

Keyword(s):

Stress Analysis ◽

Ball Grid Array ◽

Ceramic Ball ◽

Ball Grid Array Package

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Tape ball grid array package analysis

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853436 ◽

2002 ◽

Author(s):

Y.P. Wang ◽

T.D. Her

Keyword(s):

Ball Grid Array ◽

Ball Grid Array Package

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Review on the Ball Drop-off Mechanisms of Lead-free Ball Grid Array Package

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783838 ◽

2008 ◽

Author(s):

Charlie Tsung-hsing Lu

Keyword(s):

Ball Grid Array ◽

Lead Free ◽

Ball Grid Array Package

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Electrical performance trade-offs in ball grid array package designs

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526196 ◽

2002 ◽

Author(s):

K.N. Wang ◽

J.M. Adam ◽

P.A. Dziekowicz

Keyword(s):

Ball Grid Array ◽

Electrical Performance ◽

Ball Grid Array Package

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Popcorn phenomena in a ball grid array package

IEEE Transactions on Components Packaging and Manufacturing Technology Part B ◽

10.1109/96.404107 ◽

1995 ◽

Vol 18 (3) ◽

pp. 491-495 ◽

Author(s):

Seung-Ho Ahn ◽

Young-Shin Kwon

Keyword(s):

Ball Grid Array ◽

Ball Grid Array Package

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