Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

2020 ◽  
Author(s):  
Jerzy Szalapak ◽  
Konrad Kielbasinski ◽  
Lucja Dybowska-Sarapuk ◽  
Jakub Krzeminski ◽  
Marian Teodorczyk ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Silver Nanoparticles ◽  
Carbon Nanoparticles ◽  
Electronic Devices ◽  
Thermal And Electrical Properties ◽  
The Military ◽  
The Impact ◽  
High Temperature Electronic ◽  
Lower Electrical Resistivity

Abstract 90% of High Temperature Electronic devices operate in temperatures in range from 150 to 300ºC and for such temperature needs, technologies typical for the military range might be adapted. To make it possible, new joining techniques are developed, one of which is use of pastes with silver nanoparticles sintered with Low Temperature Joining Technique. Silver sintered joints have three times higher thermal conductivity and five times lower electrical resistivity than typical solders, while being able to operate in temperatures reaching 350ºC. In current paper, the authors show the impact of additions of carbon nanoparticles on joints prepared in LTJT technology. The authors prove, that an addition of few percent of graphene nanoplatelets or carbon nanotubes improves joints mechanical, thermal and electrical properties, while ensuring proper rheology of pastes.

scholarly journals Hybridization effect on Electrical Conductivity and Thermal Behavior of Epoxy/Carbon Nanotubes and Biosynthesized Silver Nanoparticles Composites

2021 ◽  
Author(s):  
Aigbodion Victor Sunday ◽  
Solomon Chijioke Madu ◽  
Uche Chinweoke Ogbuefi ◽  
C.U Nwoji
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Electrical Conductivity ◽  
Silver Nanoparticles ◽  
Epoxy Polymer ◽  
Electronic Devices ◽  
Potential Reduction ◽  
Hybridization Effect ◽  
Enhanced Thermal Conductivity ◽  
Made In

Abstract An attempt was made in this work to decorated carbon nanotubes(CNTs) in a polymer matrix using biosynthesized silver nanoparticles (GAgNPs) using Cashew leaves as a reduction agent. The new hybrid epoxy-CNTs+ GAgNPs composites were produced by modified solution-stir-cast method. The microstructure, thermal properties, strength, and electrical conductivity of the produced composites were determined. The electrical conductivity of the epoxy polymer has been enhanced from 5.6x10-13S/cm to 4.80x10-3S/cm for epoxy-0.5%CNTs and 9.1x10-3S/cm epoxy-0.5%CNTs-0.5%GAgNPs. GAgNPs was effective used to improve the strength of conducting epoxy-CNTs for electronic devices. The addition of CNTs and GAgNPs to epoxy increases the glass transition temperature. It was established that GAgNPs can be promising materials to enhanced thermal conductivity, strength, electrical conductivity of epoxy-CNTs and recover the potential reduction for electronic devices application.

Bond Line Thickness of Thermal Interface Materials With Carbon Nanotubes

2005 ◽  
Author(s):  
Senthil A. G. Singaravelu ◽  
Xuejiao Hu ◽  
Kenneth E. Goodson
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Volume Fraction ◽  
Bond Line ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Line Thickness ◽  
Bond Line Thickness ◽  
The Impact ◽  
Interface Materials

Increasing power dissipation in today’s microprocessors demands thermal interface materials (TIMs) with lower thermal resistances. The TIM thermal resistance depends on the TIM thermal conductivity and the bond line thickness (BLT). Carbon Nanotubes (CNTs) have been proposed to improve the TIM thermal conductivity. However, the rheological properties of TIMs with CNT inclusions are not well understood. In this paper, the transient behavior of the BLT of the TIMs with CNT inclusions has been measured under controlled attachment pressures. The experimental results show that the impact of CNT inclusions on the BLT at low volume fractions (up to 2 vol%) is small; however, higher volume fraction of CNT inclusions (5 vol%) can cause huge increase in TIM thickness. Although thermal conductivities are higher for higher CNT fractions, a minimum TIM resistance exists at some optimum CNT fraction for a given attachment pressure.

scholarly journals Analysis of Multiwalled Carbon Nanotubes Porosimetry And Their Thermal Conductivity with Ionic Liquid-Based Solvents

2020 ◽  
Vol 77 (2) ◽  
pp. 63-75
Author(s):  
Balaji Bakthavatchalam ◽  
Khairul Habib ◽  
R. Saidur ◽  
Nagoor Basha Shaik ◽  
Turnad Lenggo Ginta
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Ionic Liquid ◽  
Multiwalled Carbon Nanotubes ◽  
Experimental Investigations ◽  
Step Method ◽  
Multiwalled Carbon ◽  
Heat Transfer Fluids ◽  
The Impact

The suspension of nanoparticles with common heat transfer fluids like Ethylene glycol and water yields nanofluid exhibits superior thermal properties than their host fluids. Ionic liquids have the potential to demonstrate remarkable thermophysical properties (especially thermal conductivity) that ordinary nanofluids cannot achieve. On the other hand, the quantity and structure of nanoparticles porosity affects the nanofluid’s thermal conductivity considerably. Various investigations have revealed the improved thermophysical characteristicts of Multiwalled Carbon nanotubes (MWCNTs) nanofluids containing common solvents or base fluids. However, only limited studies are available on the impact of thermal conductivity in Ionic liquid-based nanofluids (Ionanofluids) owing to their high cost and viscosity. Ultrasonication technique is employed in preparing the three different Ionanofluids containing 0.5 Wt.% via the two-step method to achieve a greater stability and thermal conductivity without utilizing surfactants. Experimental investigations are performed to boost the thermal conductivity of MWCNT/Propylene glycol nanofluid using 1,3-dimethyl imidazolium dimethyl phosphate [Mmim][DMP], 1-ethyl-3-methyl imidazolium octyl sulfate [Emim][OSO4] and 1-ethyl-3-methyl imidazolium diethyl phosphate [Emim][DEP] at a temperature ranging from 295 K to 355 K. The acquired results illustrated that the thermal conductivity of MWCNT Ionanofluids incorporated with [Mmim][DMP], [Emim][OSO4] and [Emim][DEP] increased by 37.5%, 5% and 2% respectively. This unique class of Ionanofluids shows incredible capacity for use in high temperature applications as conventional heat transfer fluids.

scholarly journals Enhanced Structural, Thermal, and Electrical Properties of Multiwalled Carbon Nanotubes Hybridized with Silver Nanoparticles

2016 ◽  
Vol 2016 ◽  
pp. 1-9 ◽  
Author(s):  
Yusliza Yusof ◽  
Mohd Irwan Zaidi ◽  
Mohd Rafie Johan
Keyword(s):  
Carbon Nanotubes ◽  
Silver Nanoparticles ◽  
Electrical Properties ◽  
Multiwalled Carbon Nanotubes ◽  
Threshold Voltage ◽  
Electrical Transport ◽  
Microstructural Analysis ◽  
Sodium Dodecyl ◽  
Multiwalled Carbon ◽  
Thermal And Electrical Properties

The objective of this study is to evaluate the structural, thermal, and electrical properties of multiwalled carbon nanotubes (MWNT) hybridized with silver nanoparticles (AgNP) obtained via chemical reduction of aqueous silver salt assisted with sodium dodecyl sulphate (SDS) as stabilizing agent. Transmission electron microscopy (TEM) reveals microstructural analysis of the MWNT-Ag hybrids. The Fourier transform infrared (FTIR) spectra prove the interactions between the AgNP and carboxyl groups of the MWNT. Raman spectra reveal that the D- to G-band intensity ratiosID/IGandID′/IGincrease upon the deposition of AgNP onto the surface of the MWNT. Thermogravimetric analysis (TGA) shows that the MWNT-Ag hybrids decompose at a much faster rate and the weight loss decreased considerably due to the presence of AgNP. Nonlinearity of current-voltage (I-V) curves indicates that electrical transport of pristine MWNT is enhanced when AgNP is induced as charge carriers in the MWNT-Ag hybrids. The threshold voltageVthvalue for the MWNT doped with a maximum of 70 vol% of AgNP was substantially reduced by 65% relative to the pristine MWNT. The MWNT-Ag hybrids have a favourable electrical characteristic with a low threshold voltage that shows enhancement mode for field-effect transistor (FET) applications.

scholarly journals Heat Dissipation for Microprocessor Using Multiwalled Carbon Nanotubes Based Liquid

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Bui Hung Thang ◽  
Pham Van Trinh ◽  
Nguyen Van Chuc ◽  
Phan Hong Khoi ◽  
Phan Ngoc Minh
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Cooling System ◽  
Electronic Devices ◽  
Thermal Dissipation ◽  
Distilled Water ◽  
Liquid Cooling ◽  
Multiwalled Carbon ◽  
Liquid Cooling System ◽  
Computer Processor

Carbon nanotubes (CNTs) are one of the most valuable materials with high thermal conductivity (2000 W/m·Kcompared with thermal conductivity of Ag 419 W/m·K). This suggested an approach in applying the CNTs in thermal dissipation system for high power electronic devices, such as computer processor and high brightness light emitting diode (HB-LED). In this work, multiwalled carbon nanotubes (MWCNTs) based liquid was made by COOH functionalized MWCNTs dispersed in distilled water with concentration in the range between 0.2 and 1.2 gram/liter. MWCNT based liquid was used in liquid cooling system to enhance thermal dissipation for computer processor. By using distilled water in liquid cooling system, CPU’s temperature decreases by about 10°C compared with using fan cooling system. By using MWCNT liquid with concentration of 1 gram/liter MWCNTs, the CPU’s temperature decreases by 7°C compared with using distilled water in cooling system. Theoretically, we also showed that the presence of MWCNTs reduced thermal resistance and increased the thermal conductivity of liquid cooling system. The results have confirmed the advantages of the MWCNTs for thermal dissipation systems for theμ-processor and other high power electronic devices.

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

2005 ◽  
Vol 128 (1) ◽  
pp. 92-97 ◽  
Author(s):  
Anand Desai ◽  
Sanket Mahajan ◽  
Ganesh Subbarayan ◽  
Wayne Jones ◽  
James Geer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
High Performance ◽  
Numerical Study ◽  
Temperature Drop ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
The Impact ◽  
Interface Materials

Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150-250W per chip for high performance applications. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface materials is in the range of 1-4W∕mK, even though the bulk thermal conductivity of the material may be significantly higher. In an attempt to improve the effective in situ thermal conductivity of interface materials nanoparticles and nanotubes are being considered as a possible addition to such interfaces. This paper presents the results of a numerical study of transport in a thermal interface material that is enhanced with carbon nanotubes. The results from the numerical solution are in excellent agreement with an analytical model (Desai, A., Geer, J., and Sammakia, B., “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” J. Electron. Packaging (to be published)) of the same geometry. Wide ranges of parametric studies were conducted to examine the effects of the thermal conductivity of the different materials, the geometry, and the size of the nanotubes. An estimate of the effective thermal conductivity of the carbon nanotubes was used, obtained from a molecular dynamics analysis (Mahajan, S., Subbarayan, G., Sammakia, B. G., and Jones, W., 2003, Proceedings of the 2003 ASME International Mechanical Engineering Congress and Exposition, Washington, D.C., Nov. 15–21). The numerical analysis was used to estimate the impact of imperfections in the nanotubes upon the overall system performance. Overall the nanotubes are found to significantly improve the thermal performance of the thermal interface material. The results show that varying the diameter of the nanotube and the percentage of area occupied by the nanotubes does not have any significant effect on the total temperature drop.

scholarly journals Carbon Nanoparticles’ Impact on Processability and Physical Properties of Epoxy Resins—A Comprehensive Study Covering Rheological, Electrical, Thermo-Mechanical, and Fracture Properties (Mode I and II)

Polymers ◽  
2019 ◽  
Vol 11 (2) ◽  
pp. 231 ◽  
Author(s):  
Hauke Meeuw ◽  
Johann Körbelin ◽  
Valea Wisniewski ◽  
Ali Nia ◽  
Adrián Vázquez ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Fracture Toughness ◽  
Physical Properties ◽  
Carbon Nanoparticles ◽  
Epoxy Resins ◽  
Expanded Graphite ◽  
Filler Loading ◽  
Mode I ◽  
Walled Carbon Nanotubes ◽  
The Impact

A trade-off between enhancement of physical properties of the final part and the processability during manufacturing always exists for the application of nanocarbon materials in thermoset-based composites. For different epoxy resins, this study elaborates the impact of nanocarbon particle type, functionalization, and filler loading on the resulting properties, i.e., rheological, electrical, thermo-mechanical, as well as the fracture toughness in mode I and mode II loading. Therefore, a comprehensive set of carbon nanoparticles, consisting of carbon black (CB), single-walled carbon nanotubes (SWCNT), multi-walled carbon nanotubes (MWCNT), few layer graphene (FLG), and electrochemically expanded graphite (ExG), in purified or functionalized configuration was introduced in various epoxy resins, with different molecular weight distributions. A novel technique to introduce sharp cracks into single-edge notched bending (SENB) fracture toughness specimens led to true values. SWCNT show highest potential for increasing electrical properties without an increase in viscosity. Functionalized MWCNT and planar particles significantly increase the fracture toughness in mode I by a factor of two.

Influence of Strain States on the Thermal Transport Properties of Single and Multiwalled Carbon Nanostructures

2018 ◽  
Author(s):  
Sushan Nakarmi ◽  
V. U. Unnikrishnan
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Transport Properties ◽  
Thermal Transport ◽  
Carbon Nanostructures ◽  
Electronic Devices ◽  
Mechanical Strain ◽  
Heat Bath ◽  
Multiwalled Carbon ◽  
Thermal Transport Properties

The increasing demand for system miniaturization and high power density energy produces excessive thermal loads on electronic devices with significant mechanical strain. Carbon Nanotubes (CNTs) based devices are found to have excellent thermal transport properties that makes them attractive for thermal management of these miniaturized nano-electronic devices under extreme environments. These conductive nanostructure (carbon nanotubes, graphene, etc.) are often embedded in polymers or other high-strain alloys (the matrix phase), and are used as bridging materials for conductivity (electrical and thermal) with strain resiliency. The effect of strain on the thermal transport properties of these nanostructures have often been overlooked and will be the focus of this work. The thermal conductivity of the nanostructure is obtained in LAMMPS using the Heat-Bath method, which is a reverse non-equilibrium molecular dynamics (RNEMD) simulation strategy. In RNEMD, constant amount of heat is added to and removed from hot and cold regions and the resultant temperature gradient is measured. The effect of strain on the thermal conductivity of the single and multiwalled nanostructures of various configurations will be discussed with specific emphasis on the phonon density of states of nanotubes at different strain states.

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