Graphene Nanoplatelets/Epoxy Resin Composites With High Thermal Conductivity

2016 ◽  
Author(s):  
Yu Qi ◽  
Wei Yu ◽  
Li-Fei Chen ◽  
Hua-qing Xie ◽  
Ming-Zhu Wang
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Mass Fraction ◽  
Graphene Nanoplatelets ◽  
Resin Matrix ◽  
Heat Conducting ◽  
Molding Method ◽  
Thermal Transfer ◽  
Conducting Property ◽  
Ep Matrix

Graphene nanoplatelets (GNPs) are a kind of material with excellent thermal conductivity. It can significantly improve the heat-conducting property of epoxy resin (EP) matrix. In this study, GNPs/EP composites were prepared by ultrasonication and the cast molding method. The effect of optimization in the preparation process on the thermal transfer performance of the composites was discussed. The pulverizing time of GNPs and three-roll grinder grinding of composites were considered. The results indicated that when the mass fraction of GNPs was 4.3%, in its pulverizing time of 2s, the thermal conductivity of GNPs/EP composites was up to 0.99 W/m·K, and it was increased by 9% compared with non-pulverization treatment. However, after pulverizing two seconds and grinding three times, the thermal conductivity of the composite reached the maximum (1.06 W/m·K) when the mass fraction of GNPs was 4.3%, and it was finally increased by 307.7% compared with epoxy resin matrix.

Enhanced Thermal Conductivity for Graphene Nanoplatelets/Epoxy Resin Composites

2017 ◽  
Vol 10 (1) ◽  
Author(s):  
Dahai Zhu ◽  
Yu Qi ◽  
Wei Yu ◽  
Lifei Chen ◽  
Mingzhu Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Mass Fraction ◽  
Great Influence ◽  
Graphene Nanoplatelets ◽  
Resin Matrix ◽  
Heat Conducting ◽  
Factors Affecting ◽  
Molding Method ◽  
Ep Matrix

Graphene nanoplatelets (GNPs) have excellent thermal conductivity. It can significantly improve the heat-conducting property of epoxy resin (EP) matrix. In this paper, the GNPs/EP composites were successfully prepared by using ultrasonication and the cast molding method. The prepared GNPs/EP composites were systematically characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), and thermal conductivity analyzer. Some factors affecting the thermal transfer performance of the composites were discussed. The defoamation has great influence on the thermal conductivity of composite. There is a nearly linear relationship between the mass fraction and the thermal conductivity of composite when the mass fraction of GNPs is below 4.3%. The results show that when the mass fraction of GNPs is 4.3% with crushing time of 2 s, the thermal conductivity of GNPs/EP composite is up to 0.99 W/m K. The thermal conductivity is increased by 9.0% compared with that without pulverization treatment (0.91 W/m K). When it is ground three times, the thermal conductivity of composite reaches the maximum (1.06 W/m K) and it is increased by 307.7% compared with that of epoxy resin matrix.

Improved Thermal Conductivity of Compostie Particles Filled Epoxy Resin

2011 ◽  
Vol 217-218 ◽  
pp. 439-444 ◽  
Author(s):  
Xiu Ju Zhang ◽  
Zhi Dan Lin ◽  
Bo Li ◽  
Shao Zao Tan
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Silicon Nitride ◽  
Boron Nitride ◽  
Epoxy Resin ◽  
Resin Matrix ◽  
Heat Conducting ◽  
Curing Agent ◽  
Conductive Property ◽  
Conductive Properties

E-44 epoxy resin was used as matrix，and silicon nitride，boron nitride，alumina and silicon carbide were used as heat-conducting insulating fillers. By selecting the amounts and types of the insulting fillers, the heat conductive properties of E-44 could be adjusted. In addition, by choosing the curing agent and accelerator the viscosity of E-44 could also be readily controlled. The relation among the adhesive viscosity，heat conductive property and prescription was studied. When the amounts of silicon nitride, alumina and boron nitride were 25%, 25%, 10% (based on the mass of epoxy resin matrix), respectively, the thermal conductivity of this system was 2.66 W/mK.

scholarly journals Effect of Alumina Nanowires on the Thermal Conductivity and Electrical Performance of Epoxy Composites

Polymers ◽  
2020 ◽  
Vol 12 (9) ◽  
pp. 2126
Author(s):  
Liangsong Huang ◽  
Xitao Lv ◽  
Yongzhe Tang ◽  
Guanghui Ge ◽  
Peng Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Mass Fraction ◽  
Breakdown Strength ◽  
Epoxy Composites ◽  
Electrical Performance ◽  
Resin Matrix ◽  
Resin Composites ◽  
Dielectric Performance ◽  
Epoxy Resin Composites

Alumina nanowires (Al2O3-NWs)/epoxy resin composites have been thoroughly studied due to their excellent insulating and dielectric performance. In particular, understanding the effect of nano-alumina with different morphologies on the dielectric performance of composites is of great significance. In this study, Al2O3-NWs with lengths of approximately 100 nm and diameters of approximately 5 nm were prepared and blended with anepoxy resin to form composites, and the effect of the mass fraction of fillers on the thermal conductivity of the composites was investigated. Specifically, the effect of alumina fillers with ananowire structure on the insulating and dielectric performance and breakdown strength of the epoxy composites were analyzed. The influence principle of the interfacial effect and heat accumulation on the dielectric and insulating properties of the composites were described. The results demonstrated that the thermal conductivity of Al2O3-NWs/epoxy resin composites was higher than that of the bare epoxy resin. The thermal conductivity of Al2O3-NWs/epoxy resin composites increased with increasing mass fraction of fillers. When the mass fraction of fillers was 10%, the thermal conductivity of the composite was 134% higher than that of the epoxy resin matrix. The volume resistivity of the composites first increased and then decreased as the mass fraction of fillers increased, while the dielectric constant of the composites increased with increasing mass fraction of fillers and decreasing frequency. The dielectric loss of the composites decreased and then increased as the mass fraction of fillers increased, and it increased with increasing frequency. Additionally, the alternating current breakdown strength of the composites first increased and then decreased withincreasingmass fraction of fillers.

scholarly journals Preparation and Thermal Conductivity of Epoxy Resin/Graphene-Fe3O4 Composites

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2013
Author(s):  
Zhong Wu ◽  
Jingyun Chen ◽  
Qifeng Li ◽  
Da-Hai Xia ◽  
Yida Deng ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Epoxy Resin ◽  
Thermomechanical Properties ◽  
Packaging Materials ◽  
Mass Ratio ◽  
Degree Of Orientation ◽  
Ep Matrix ◽  
Electrical Insulation Properties

By modifying the bonding of graphene (GR) and Fe3O4, a stable structure of GR-Fe3O4, namely magnetic GR, was obtained. Under the induction of a magnetic field, it can be orientated in an epoxy resin (EP) matrix, thus preparing EP/GR-Fe3O4 composites. The effects of the content of GR and the degree of orientation on the thermal conductivity of the composites were investigated, and the most suitable Fe3O4 load on GR was obtained. When the mass ratio of GR and Fe3O4 was 2:1, the thermal conductivity could be increased by 54.8% compared with that of pure EP. Meanwhile, EP/GR-Fe3O4 composites had a better thermal stability, dynamic thermomechanical properties, and excellent electrical insulation properties, which can meet the requirements of electronic packaging materials.

Studies on Thermal Property of Silica Aerogel/Epoxy Composite

2007 ◽  
Vol 546-549 ◽  
pp. 1581-1584 ◽  
Author(s):  
Jiu Peng Zhao ◽  
Deng Teng Ge ◽  
Sai Lei Zhang ◽  
Xi Long Wei
Keyword(s):  
Thermal Conductivity ◽  
Thermal Property ◽  
Epoxy Resin ◽  
Silica Aerogel ◽  
Epoxy Composite ◽  
Transfer Model ◽  
Insulation Material ◽  
Thermal Transfer ◽  
Heat Distortion Temperature ◽  
Ft Ir

Silica aerogel/epoxy composite, a kind of efficient thermal insulation material, was prepared by doping silica aerogel of different sizes into epoxy resin through thermocuring process. The results of thermal experiments showed that silica aerogel/epoxy composite had a lower thermal conductivity (0.105W/(m·k) at 60 wt% silica aerogel) and higher serviceability temperature (Martens heat distortion temperature: 160°C at 20 wt% silica aerogel). In addition, the composite doping larger size (0.2-2mm) of silica aerogel particle had lower thermal conductivity and higher Martens heat distortion temperature. Based on the results of SEM and FT-IR, the thermal transfer model was established. Thermal transfer mechanism and the reasons of higher Martens heat distortion temperature have been discussed respectively.

Study on Properties of Epoxy Resin /Al2O3 Composites

2013 ◽  
Vol 652-654 ◽  
pp. 116-120 ◽  
Author(s):  
Yong Jiu Zhao ◽  
Xin Min Huang ◽  
Rong Rong Dai ◽  
Wei Zhang ◽  
Yu Cheng Wu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Fracture Surface ◽  
Epoxy Resin ◽  
Mass Fraction ◽  
Thermal Conductivity Coefficient ◽  
Al2o3 Content ◽  
Peak Shape ◽  
Al2o3 Composite ◽  
New Type

An epoxy resin/Al2O3 composite was prepared via a new type of process.The effects of Al2O3 content on the mechanical properties and thermal conductivity of the composite were investigated.It shows that the thermal conductivity of the epoxy resin/Al2O3 composite aggrandizes with the addition of aluminum oxide.As the content of Al2O3 is 30%,the thermal conductivity coefficient reaches 0.46W/m·K. Al2O3 particles can hinder the propagation of flaw or make crack change direction.and lead to generate scales flake and islands peak shape on the fracture surface when The thetensile fracture surfaces tested under the liquid nitrogen temperatures(77k). When the mass fraction of Al2O3 is 20%, the mechanics properties of the composite is better

The Preparation and Properties of Si3N4-Filled Epoxy Resin Composites for Electronic Packaging

2007 ◽  
Vol 336-338 ◽  
pp. 1346-1349 ◽  
Author(s):  
Ren Li Fu ◽  
Ke Xin Chen ◽  
Jin Tang ◽  
Yuan Shen ◽  
Hong He
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Epoxy Resin ◽  
Volume Fraction ◽  
Resin Composite ◽  
Thermal Conductance ◽  
Molding Method ◽  
Epoxy Resin Composite ◽  
Filled Composite ◽  
Press Molding

Si3N4-filled epoxy resin composite was fabricated employing liquid press molding method. Properties, such as thermal conductivity, dielectric constant of Si3N4-filled epoxy resin composite were evaluated, the effect of the content of Si3N4 and surface treatment of the filler was also considered. A silane coupling agent, namely NH2−(CH2)3Si−(OC2H5)3, was applied to functionalize the surface of Si3N4 filler. Experimental results showed that the thermal conductivity of the composites is strongly dependent on the filler and is dominated by the interface of epoxy resin and Si3N4 particles. As the Si3N4 volume fraction increasing, thermal conductance of Si3N4-filled composite was improved obviously, especially for that of silane-treated Si3N4 powder filled composite. Dielectric constant of the composite increases linearly, however, it still remains at a relatively low level (<5, at 1MHz).

The Experiment Study on Thermal Conductivity of Loess-Like Soil

2012 ◽  
Vol 204-208 ◽  
pp. 59-62
Author(s):  
Liang Liang Guo ◽  
Zhen Zhou Mei ◽  
Bing Qiang Zhou
Keyword(s):  
Thermal Conductivity ◽  
Feasible Solution ◽  
Northern China ◽  
Heat Conducting ◽  
Experiment Study ◽  
Temperature Variance ◽  
Conducting Property ◽  
Empirical Relations ◽  
Testing Error ◽  
Important Significance

The author measured the TC of losses-like soil in Changchun with QTM-D2 and discussed the effect of samples in different sizes, the testing error in lab and in site. The research about the size error of TC offered feasible solution to measure TC of geotechnical materials in site. In addition, the empirical relations between TC and temperature of sand and loess-like soil, and their temperature variance coefficient  were also summed up by experiments. It has important significance to understand the heat-conducting property and simulate temperature field of geotechnical materials in northern China.

Thermal Conductivity and Mechanical Properties of Low-Density Silicone Rubber Filled With Al2O3 and Graphene Nanoplatelets

2017 ◽  
Vol 10 (1) ◽  
Author(s):  
Yingchun Zhang ◽  
Wei Yu ◽  
Liye Zhang ◽  
Junshan Yin ◽  
Jingkang Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicone Rubber ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Thermal Contact ◽  
Graphene Nanoplatelets ◽  
Rubber Matrix ◽  
Heat Conducting ◽  
Light Emitting ◽  
Potential Applications

A simple approach is developed to obtain a multiscale network of heat conducting by filling spherical alumina (S-Al2O3) and graphene nanoplatelets (GnPs) into silicone rubber (SR). This unique structure effectively minimizes the thermal contact resistance between fillers and matrix. The physical properties of the composites are characterized by thermal conductivity, density, and tensile strength. A high thermal conductivity of 3.37 Wm−1 K−1 has been achieved, which is 47.1% higher than the single filler at the same loading. A strong and obvious synergistic effect has been observed as S-Al2O3 and GnPs filled into silicone rubber matrix. It is interesting that the composites with GnPs have the lower density (2.62 g/cm3, reduced by 6%) and the superior tensile performance, compared to silicone rubber composite with neat S-Al2O3. The composites have the potential applications in heat dissipation of light-emitting diode.

scholarly journals D-GQDs Modified Epoxy Resin Enhances the Thermal Conductivity of AlN/Epoxy Resin Thermally Conductive Composites

Polymers ◽  
2021 ◽  
Vol 13 (23) ◽  
pp. 4074
Author(s):  
Duanwei Zhang ◽  
Fusheng Liu ◽  
Sheng Wang ◽  
Mengxi Yan ◽  
Xin Hu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Epoxy Resin ◽  
Graphene Quantum Dots ◽  
Interfacial Thermal Resistance ◽  
Resin Matrix ◽  
Conductive Composites ◽  
Thermally Conductive ◽  
Branched Chains ◽  
Modified Epoxy

This article proposes a method of increasing thermal conductivity (λ) by improving the λ value of a matrix and reducing the interfacial thermal resistance between such matrix and its thermally conductive fillers. D-GQDs (graphene quantum dots modified by polyetheramine D400) with a π–π-conjugated system in the center of their molecules, and polyether branched chains that are rich in amino groups at their edges, are designed and synthesized. AlN/DG-ER (AlN/D-GQDs-Epoxy resin) thermally conductive composites are obtained using AlN as a thermally conductive and insulating filler, using D-GQDs-modified epoxy resin as a matrix. All of the thermal conductivity, electrically insulating and physical–mechanical properties of AlN/DG-ER are investigated in detail. The results show that D-GQDs linked to an epoxy resin by chemical bonds can increase the value of λ of the epoxy–resin matrix and reduce the interfacial thermal resistance between AlN and DG-ER (D-GQDs–epoxy resin). The prepared AlN/DG-ER is shown to be a good thermally conductive and insulating packaging material.

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