scholarly journals Temperature monitoring with a high-speed camera based on two color method and its CFD analysis in Cu direct laser drilling of printed circuit board

2021 ◽  
Author(s):  
Toshiki HIROGAKI ◽  
Eiichi AOYAMA ◽  
Ryouta YAMAGUCHI ◽  
Wataru NAKAGAWA
Keyword(s):  
High Speed ◽  
Printed Circuit Board ◽  
Laser Drilling ◽  
Temperature Monitoring ◽  
Circuit Board ◽  
High Speed Camera ◽  
Cfd Analysis ◽  
Printed Circuit ◽  
Direct Laser

Design of Equivalent Sampling Based on Printed Circuit Board Suited for Power Communication System

2013 ◽  
Vol 333-335 ◽  
pp. 465-471
Author(s):  
Chuan Liu ◽  
Zhi Chao Huang ◽  
Peng Wu ◽  
Lei Chen ◽  
Wei Wang
Keyword(s):  
Time Delay ◽  
Communication System ◽  
High Speed ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Transmission Time ◽  
Clock Signal ◽  
Signal Delay ◽  
Printed Circuit ◽  
Sequential Logic

Many applications in Power communication system have a demand of adjustable transmission time delay of high-speed signal. In sequential logic circuit, the control of transmission time delay of high-speed signal can effectively improve the accuracy of clock sampling, as a result, satisfy the constraints between clock signal and periodic data. A method of equivalent sampling based on printed circuit board (PCB) is provided in the article, it realizes equivalent sampling of the data by fixing a group of clock signal delay, thus, increase the accuracy of sampling.

scholarly journals Multiphysics analysis of printed circuit board winding for high‐speed axial flux permanent magnet motor

2019 ◽  
Vol 13 (6) ◽  
pp. 805-811 ◽  
Author(s):  
Neethu Salim ◽  
Saurabh Prakash Nikam ◽  
Saumitra Pal ◽  
Ashok Krishnrao Wankhede ◽  
Baylon Godfrey Fernandes
Keyword(s):  
Permanent Magnet ◽  
High Speed ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Permanent Magnet Motor ◽  
Axial Flux ◽  
Printed Circuit

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

2009 ◽  
Vol 38 (6) ◽  
pp. 884-895 ◽  
Author(s):  
E.H. Wong ◽  
S.K.W. Seah ◽  
C.S. Selvanayagam ◽  
R. Rajoo ◽  
W.D. van Driel ◽  
...  
Keyword(s):  
High Speed ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Printed Circuit ◽  
Drop Tests ◽  
Bend Tests ◽  
Board Level
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