Deposition process and characterization of chromium-carbon coatings produced by direct sputtering of a magnetron chromium carbide target

1994 ◽  
Vol 9 (7) ◽  
pp. 1820-1828 ◽  
Author(s):  
N. Maréchal ◽  
E. Quesnel ◽  
Y. Pauleau
Keyword(s):  
Electrical Resistivity ◽  
Residual Stresses ◽  
Chromium Carbide ◽  
Bias Voltage ◽  
Bulk Material ◽  
Deposition Process ◽  
Gas Pressure ◽  
Atom Number ◽  
Carbon Coatings ◽  
Self Bias

Chromium-carbon coatings have been deposited on various substrates by direct sputtering of a chromium carbide, Cr3C2, target in pure argon atmosphere. The composition of coatings determined by Rutherford backscattering spectroscopy and the deposition rate were investigated as functions of the sputtering gas pressure and self-bias voltage applied to substrates. The atom number ratio C/Cr in the coatings was equal to 0.7 regardless of the deposition conditions investigated. Oxygen and argon atoms were the major impurities incorporated in the amorphous coatings. Oxygen-free Cr-C coatings were prepared at low argon pressures or on substrates biased to a voltage in the range −100 to −320 V. The Cr-C coatings deposited on biased substrates contained less than 2 at. % of argon. The morphological features of Cr-C coatings examined by scanning electron microscopy were also dependent on the sputtering gas pressure and bias voltage of substrates. Fully dense structures were observed for coatings deposited at low argon pressures or on biased substrates. The electrical resistivity of Cr-C coatings was extremely dependent on the concentration of oxygen atoms incorporated in the coatings. Oxygen-free Cr-C coatings exhibited electrical resistivity values as low as 120 μΩ cm, i.e., less than twice the bulk resistivity of Cr3C2. The residual stresses in the coatings and microhardness of the deposited material were also investigated as functions of the deposition parameters. Tensile residual stresses were lower than 0.8 GPa, and the maximum microhardness of coatings was about 13000 MPa, i.e., similar to that of the bulk material.

Influence of Deposition Parameters on the Properties of Nanocomposite Coatings Prepared by Cathodic Arc Evaporation

2016 ◽  
Vol 368 ◽  
pp. 77-81
Author(s):  
Miroslav Béger ◽  
Jozef Sondor ◽  
Martin Sahul ◽  
Paulína Zacková ◽  
Marián Haršáni ◽  
...  
Keyword(s):  
Residual Stresses ◽  
Bias Voltage ◽  
Deposition Process ◽  
Gas Pressure ◽  
Nanocomposite Coatings ◽  
Evaporation Process ◽  
Deposition Parameters ◽  
Cathodic Arc Evaporation ◽  
Arc Evaporation ◽  
Cathodic Arc

The article deals with the influence of different deposition parameters on the selected properties of AlCrN/Si3N4 nanocomposite coatings. Bias voltage, cathodes currents and working gas pressure were changed during the deposition process. All coatings were deposited using Lateral Rotating Cathodes (LARC®) process that belongs to the group of cathodic arc evaporation PVD technologies. In comparison with the typical cathodic arc evaporation process which usually uses planar targets the LARC® process utilizes rotational cathodes that are positioned close to each other. Nanohardness, Young's modulus, thickness and residual stresses were determinated in order to evaluate the influence of deposition parameters on these coatings properties

Ion flux's pressure dependence in an asymmetric capacitively coupled rf discharge in NF3

Open Physics ◽  
2004 ◽  
Vol 2 (1) ◽  
pp. 1-11 ◽  
Author(s):  
Emil Mateev ◽  
Ivan Zhelyazkov
Keyword(s):  
Bias Voltage ◽  
Essential Feature ◽  
Gas Pressure ◽  
Ion Flux ◽  
The Self ◽  
Rf Discharge ◽  
Rf Power ◽  
Capacitively Coupled ◽  
Self Bias ◽  
Basic Equations

AbstractStarting from an analytical macroscopic/phenomenological model yielding the self-bias voltage as a function of the absorbed radio-frequency (rf) power of an asymmetric capacitively coupled discharge in NF3 this paper studies the dependence of the ion flux onto the powered electrode on the gas pressure. An essential feature of the model is the assumption that the ions' drift velocity in the sheath near the powered electrode is proportional to E α, where E=−ΔU (U being the self-bias potential), and α is a coefficient depending on the gas pressure and cross section of elastic ion-neutral collisions. The model also considers the role of γ-electrons, stochastic heating as well as the contribution of the active electron current to the global discharge power balance. Numerically solving the model's basic equations one can extract the magnitude of the ion flux (at three different gas pressures) in a technological etching device (Alcatel GIR 220) by using easily measurable quantities, notably the self-bias voltage and absorbed rf power.

Microstructure and Stress Analyses of Copper Films Deposited on Biased Substrates by Microwave Plasma-Assisted Sputtering

2002 ◽  
Vol 750 ◽  
Author(s):  
François Thièry ◽  
Yves Pauleau ◽  
Yves Arnal ◽  
Jacques Pelletier ◽  
Luc Ortega
Keyword(s):  
Electrical Resistivity ◽  
Surface Morphology ◽  
Residual Stresses ◽  
Bias Voltage ◽  
Microwave Plasma ◽  
Copper Films ◽  
Substrate Bias ◽  
Substrate Bias Voltage ◽  
Si Substrates ◽  
Argon Ions

ABSTRACTPure copper films have been deposited on <100> Si substrates either at the floating potential or biased to various dc voltages ranging from 0 to - 125 V. Argon ions from the discharge produced in a distributed electron cyclotron resonance microwave plasma reactor were used for sputtering of a copper target biased to various dc voltages. For sputter deposition, the Si substrates placed on a water-cooled substrate holder were maintained at ambient temperature. The argon pressure was 0.13 Pa and the dc target voltage was fixed at - 600 V. The deposition rate of films was investigated as a function of the substrate bias voltage. The crystallographic structure of films and size of copper crystallites were determined by x-ray diffraction analyses. The surface morphology of films was examined by atomic force microscopy. The electrical resistivity of films was deduced from the thickness and sheet resistance of films determined by profilometry and four point probe measurements, respectively. The magnitude of residual stresses in copper films was calculated from the radius of curvature of Cu/Si samples deduced from profilometry measurements. The evolution of the microstructure, surface morphology and electrical resistivity of films as well as the magnitude of residual stresses developed in these films were studied as functions of the substrate bias voltage. These major characteristics of films were found to be dependent on the energy of argon ions impinging on the surface of films grown on biased substrates. The effect of the ion energy on the physical features of films is analyzed and discussed in this paper.

Estimation of Ion Impact Energies and Electrode Self-Bias Voltage in Capacitive RF Discharges

1987 ◽  
Vol 98 ◽  
Author(s):  
S. E. Savas
Keyword(s):  
Bias Voltage ◽  
Capacitively Coupled ◽  
Ion Flow ◽  
Rf Discharges ◽  
Self Bias ◽  
Ion Energies ◽  
Bias Ratio ◽  
Ionization Model ◽  
Ion Impact ◽  
Impact Energies

ABSTRACTThe dependences of the electrode self-bias voltage and the ratio of ion energies on electrode area ratio are calculated for a model of capacitively coupled rf discharges. It is assumed that concentric spherical elecrodes with fluid-like radial ion flow adequately models the ion motion, that sheath impedances are dominant, and that ionization processes in the glow are due to ohmically heated electrons. Results show that the ratio of ion energies impacting the smaller electrode to those on the larger depends on the ratio of electrode areas in a more complex manner than a power law.The reason for this is that sheath impedances are more resistive or capacitive at different times in the rf cycle. The self-bias ratio is found to depend relatively little on the ionization model or the pressure but differs substantially from the “power law” result. The agreement of measurements with the model is fairly good.

Effects of bias voltage and gas pressure on orientation and microstructure of iridium coating by double glow plasma

Vacuum ◽  
2011 ◽  
Vol 86 (4) ◽  
pp. 429-437 ◽  
Author(s):  
Wangping Wu ◽  
Zhaofeng Chen ◽  
Xin Lin ◽  
Binbin Li ◽  
Xiangna Cong
Keyword(s):  
Bias Voltage ◽  
Gas Pressure ◽  
Glow Plasma

scholarly journals Fully resolved numerical simulations of fused deposition modeling. Part II – solidification, residual stresses and modeling of the nozzle

2018 ◽  
Vol 24 (6) ◽  
pp. 973-987 ◽  
Author(s):  
Huanxiong Xia ◽  
Jiacai Lu ◽  
Gretar Tryggvason
Keyword(s):  
Residual Stresses ◽  
Numerical Simulations ◽  
Fused Deposition Modeling ◽  
Fixed Bed ◽  
Ground Truth ◽  
Deposition Process ◽  
Material Behavior ◽  
Content Type ◽  
Fused Deposition ◽  
Deposition Modeling

Purpose The purpose of this paper is to continue to describe the development of a comprehensive methodology for fully resolved numerical simulations of fused deposition modeling. Design/methodology/approach A front-tracking/finite volume method introduced in Part I to simulate the heat transfer and fluid dynamics of the deposition of a polymer filament on a fixed bed is extended by adding an improved model for the injection nozzle, including the shrinkage of the polymer as it cools down, and accounting for stresses in the solid. Findings The accuracy and convergence properties of the new method are tested by grid refinement, and the method is shown to produce convergent solutions for the shape of the filament, the temperature distribution, the shrinkage and the solid stresses. Research limitations/implications The method presented in the paper focuses on modeling the fluid flow, the cooling and solidification and volume changes and residual stresses, using a relatively simple viscoelastic constitutive model. More complex material models, depending, for example, on the evolution of the conformation tensor, are not included. Practical implications The ability to carry out fully resolved numerical simulations of the fused deposition process is expected to be critical for the validation of mathematical models for the material behavior, to help explore new deposition strategies and to provide the “ground truth” for the development of reduced-order models. Originality/value The paper completes describing the development of the first numerical method for fully resolved simulation of fused filament modeling.

scholarly journals Study of the bias voltage influence on the structure, texture and residual stresses in Ta coatings deposited on a copper substrate of inverted magnetron

2019 ◽  
Vol 1396 ◽  
pp. 012028 ◽  
Author(s):  
A S Lenkovets ◽  
A A Lozovan ◽  
S Ya Betsofen ◽  
A V Bespalov ◽  
I A Grushin ◽  
...  
Keyword(s):  
Residual Stresses ◽  
Bias Voltage ◽  
Copper Substrate

scholarly journals The Corrosion Resistance of Aluminum–Bronze Coatings as a Function of Gas Pressure Used in the Thermal Spraying Process

Coatings ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 507 ◽  
Author(s):  
Alfredo Morales ◽  
Oscar Piamba ◽  
Jhon Olaya
Keyword(s):  
Corrosion Resistance ◽  
Electrochemical Impedance ◽  
Thermal Spraying ◽  
Deposition Process ◽  
Gas Pressure ◽  
Aluminum Bronze ◽  
Porosity Level ◽  
X Ray ◽  
Aluminum Coatings ◽  
Transmission Electron

We report the results of the influence of acetylene and oxygen gas pressure on the corrosion resistance of bronze–aluminum coatings deposited on a naval brass substrate by means of the thermal (flame) deposition process. The coatings were characterized by means of scanning electronic microscopy (SEM), energy-dispersive X-ray spectrometry (EDS), X-ray diffraction (XRD), X-ray fluorescence (XRF), and transmission electron microscopy (TEM). The corrosion tests were carried out via Tafel and electrochemical impedance spectroscopy (EIS). In addition, some samples were selected in order to investigate heat treatment and its effects on corrosion resistance. The results indicate that changes in the pressure and flow of the gas affects the composition, morphology, and physical properties of the coatings, and these effects have consequences for the behavior of the coatings when they are immersed in corrosion environments. The collision speed of the particles was identified as the most significant factor that influences the properties and the performance of the coating. The gas pressure modified the oxides and the porosity level, which improved the corrosion resistance.

Sign in / Sign up

Export Citation Format

Share Document