P-type Conduction in Bulk ZnSe by Nitrogen Ion-Implantation

1991 ◽  
Vol 228 ◽  
Author(s):  
M. K. Jin ◽  
T. Yasuda ◽  
K. Shahzad ◽  
J. L. Merz
Keyword(s):  
Ion Implantation ◽  
Thermal Annealing ◽  
Annealing Temperature ◽  
Hole Concentration ◽  
Implantation Damage ◽  
Hall Effect Measurements ◽  
Nitrogen Ion ◽  
P Type ◽  
Optical Behavior ◽  
Type Conduction

ABSTRACTP-type conduction in bulk ZnSe has been achieved using 1×1016 cm−2 nitrogen (N) ionimplantation followed by a high temperature rapid thermal annealing. Room temperature Hall effect measurements of the sample show that the hole concentration is ∼1×1017 cm−3, and the mobility is ∼30 cm2/V-s. Photoluminescence (PL) measurements were performed to study the optical behavior of the samples, and the results show that the ion implantation damage can be partially repaired by thermal annealing at 900°C or higher. Thermal degradation and recovery of the ion-implantation damage were studied as a function of the annealing temperature.

scholarly journals Electrical Characterization of MOVPE-Grown P-Type GaN:Mg Against Annealing Temperature

1999 ◽  
Vol 4 (S1) ◽  
pp. 665-670 ◽  
Author(s):  
Shizuo Fujita ◽  
Mitsuru Funato ◽  
Doo-Cheol Park ◽  
Yoshifumi Ikenaga ◽  
Shigeo Fujita
Keyword(s):  
Annealing Temperature ◽  
Hole Concentration ◽  
Electrical Characterization ◽  
Sapphire Substrates ◽  
Electrical Degradation ◽  
Scattering Centers ◽  
Hall Effect Measurements ◽  
P Type ◽  
Mg Doped

Hall effect measurements have been applied for the electrical characterization of p-type Mg-doped GaN grown by metalorganic vapor-phase epitaxy on sapphire substrates in terms of annealing temperature for dehydrogenation (N2 annealing) and hydrogenation (H2 annealing) of the acceptors. With the N2 annealing temperature from 600 to 900 °C for dehydrogenation, both hole concentration and mobility increases, showing more activation of acceptors and less incorporation of unfavorable scattering centers probably originating from Mg-H bondings. The N2 annealing at higher than the growth temperature results in reduced hole concentration, but the mobility gets higher. Some defects compensating acceptors may be induced at high temperature annealing, but they seem to be no scattering centers and be inactivated by successive hydrogenation and re-dehydrogenation at the optimum dehydrogenation temperature 900 °C. The electrical degradation of GaN due to thermal damage is not very destructive and can be well recovered by annealing treatments.

Electrical Characterization of MOVPE-GROWN P-Type GaN:Mg Against Annealing Temperature

1998 ◽  
Vol 537 ◽  
Author(s):  
Shizuo Fujita ◽  
Mitsuru Funato ◽  
Doo-Cheol Park ◽  
Yoshifumi Ikenaga ◽  
Shigeo Fujita
Keyword(s):  
Annealing Temperature ◽  
Hole Concentration ◽  
Electrical Characterization ◽  
Sapphire Substrates ◽  
Electrical Degradation ◽  
Scattering Centers ◽  
Hall Effect Measurements ◽  
P Type ◽  
Mg Doped

AbstractHall effect measurements have been applied for the electrical characterization of p-type Mg-doped GaN grown by metalorganic vapor-phase epitaxy on sapphire substrates in terms of annealing temperature for dehydrogenation (N2 annealing) and hydrogenation (H2 annealing) of the acceptors. With the N2 annealing temperature from 600 to 900°C for dehydrogenation, both hole concentration and mobility increases, showing more activation of acceptors and less incorporation of unfavorable scattering centers probably originating from Mg-H bondings. The N2 annealing at higher than the growth temperature results in reduced hole concentration, but the mobility gets higher. Some defects compensating acceptors may be induced at high temperature annealing, but they seem to be no scattering centers and be inactivated by successive hydrogenation and re-dehydrogenation at the optimum dehydrogenation temperature 900°C. The electrical degradation of GaN due to thermal damage is not very destructive and can be well recovered by annealing treatments.

scholarly journals Investigation of spray pyrolyzed cubic structured Cu doped SnS films

2021 ◽  
Author(s):  
Emrah SARICA
Keyword(s):  
Spray Pyrolysis Technique ◽  
Hole Concentration ◽  
Compressive Strain ◽  
Cubic Phase ◽  
Cu Doping ◽  
Glass Substrates ◽  
High Electrical Resistivity ◽  
Hall Effect Measurements ◽  
P Type ◽  
Deposited Films

Abstract In this work undoped and Cu doped SnS film at 4% and 8% were deposited onto glass substrates by spray pyrolysis technique in order to investigate the effect of Cu doping on their physical properties. Surface investigations showed that Cu doping reduced the surface roughness of SnS films from 36.5 nm to 8.8 nm. XRD studies revealed that all films have recently solved large cubic phase of SnS (p-SnS) with a- lattice of 11.53 Å and Cu doping led to reduction in crystallite size from 229 Å to 198 Å. Additionally, all deposited films were found to be under compressive strain. Optical band gaps of SnS:Cu varied in the range of 1.83 eV-1.90 eV. Hall-effect measurements exhibited that all film have p-type conductivity with low hole concentration (~10 11 -10 12 cm -3 ) and high electrical resistivity (~10 4 -10 5 Ωcm).

Characterization of Ion Implantation Damage in Capless Annealed GaAs

1983 ◽  
Vol 27 ◽  
Author(s):  
H. Kanber ◽  
M. Feng ◽  
J. M. Whelan
Keyword(s):  
Ion Implantation ◽  
Annealing Temperature ◽  
Rutherford Backscattering ◽  
Buffer Layers ◽  
Electrical Activation ◽  
Controlled Atmosphere ◽  
Damage Characteristics ◽  
Implantation Damage ◽  
Implantation Process

ABSTRACTArsenic and argon implantation damage is characterized by Rutherford backscattering in GaAs undoped VPE buffer layers grown on Cr-O doped semi-insulating substrates and capless annealed in a H2 −As4 atmosphere provided by AsH3. The damage detected in the RBS channeled spectra varies as a function of the ion mass, the implant depth and the annealing temperature of the stress-free controlled atmosphere technique. This damage is discussed in terms of the stoichiometric disturbances introduced by the implantation process. The as-implanted and annealed damage characteristics of the Ar and As implants are correlated to the electrical activation characteristics of Si and Se implants in GaAs, respectively.

Modification of The Near-Surface Region Of Al2O3 By Ion Implantation

1983 ◽  
Vol 24 ◽  
Author(s):  
C. W. White ◽  
G. C. Farlow ◽  
H. Naramoto ◽  
C. J. Mchargue ◽  
B. R. Appleton
Keyword(s):  
Mechanical Properties ◽  
Ion Implantation ◽  
Thermal Annealing ◽  
Structural Property ◽  
Surface Region ◽  
Impurity Incorporation ◽  
Near Surface ◽  
Implantation Damage ◽  
Property Changes

ABSTRACTPhysical and structural property changes resulting from ion implantation and thermal annealing of α-A12O3 are reviewed. Emphasis is placed on damage production during implantation, damage recovery during thermal annealing, and impurity incorporation during thermal annealing. Physical and structural property changes caused by ion implantation and annealing are correlated with changes in the mechanical properties.

Electrical and Optical Properties of Carbon Doped Cubic GaN Epilayers Grown Under Extreme Ga Excess

2003 ◽  
Vol 798 ◽  
Author(s):  
D. J. As ◽  
D. G. Pacheco-Salazar ◽  
S. Potthast ◽  
K. Lischka
Keyword(s):  
Optical Properties ◽  
Hole Concentration ◽  
Hole Mobility ◽  
Growth Conditions ◽  
Rf Plasma ◽  
Electrical And Optical Properties ◽  
Carbon Doped ◽  
Cubic Gan ◽  
Hall Effect Measurements ◽  
P Type

ABSTRACTP-type doping of cubic GaN by carbon is reported with maximum hole concentration of 2 6.1×1018cm-3and hole mobility of 23.5 cm /Vs at room temperature, respectively. The cubic GaN:C was grown by rf-plasma assisted molecular beam epitaxy (MBE) under Ga-rich growth conditions on a semiinsulating GaAs (001) substrate (3 inches wafer). E-beam evaporation of a graphite rode with an C-flux of 1×1012cm-2s-1was used for C-doping of the c-GaN. Optical microscopy, Hall-effect measurements and photoluminescence were performed to investigate the morphological, electrical and optical properties of cubic GaN:C. Under Ga-rich growth conditions most part of the carbon atoms were incorporated substitutially on N-site giving p-type conductivity. Our results verify that effective p-type doping of c-GaN can be achieved under extrem Ga excess.

Phosphorus-Doped p-Type ZnS Nanowires and their Photodetecting Applications Based on Device Construction

2016 ◽  
Vol 42 ◽  
pp. 65-72 ◽  
Author(s):  
Xi Wei Zhang ◽  
Dan Hu ◽  
Dan Meng ◽  
Zhen Jie Tang ◽  
Zhi Wang
Keyword(s):  
High Performance ◽  
Uv Light ◽  
Hole Concentration ◽  
Chemical Deposition ◽  
Core Shell ◽  
Light Illumination ◽  
Chemical Deposition Method ◽  
P Type ◽  
Phosphorus Doped ◽  
Type Conduction

Phosphorus-doped p-type ZnS NWs were synthesized by chemical deposition method. The as-synthesized NWs shows obvious p-type conduction with a hole concentration of 8.35 × 1017 cm-3. ZnS-Si core-shell nanoheterojunction was fabricated by depositing Si thin film on the surface of ZnS NWs through a sputtering method. The core-shell nanostructure exhibited excellent photoresponse to white light and UV light. Under UV light illumination, a high performance with a responsibility of ~ 0.14 × 103 AW-1, a gain of ~ 0.69 × 103 and a detectivity of ~ 1.2 × 1010 cmHz1/2W-1 were obtained based on the ZnS-Si core-shell nanoheterojunction. This new nanostructure is expected to play an important role in the next-generation optoelectronic devices.

Supersaturated P-Type Polycrystaline Films Produced by Rapid Thermal Annealing of High Dose Boron Ion Implants for Interconnects and Shallow Junction Diffusion Sources

1990 ◽  
Vol 182 ◽  
Author(s):  
B. Raicu ◽  
M.I. Current ◽  
W.A. Keenan ◽  
D. Mordo ◽  
R. Brennan ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Thermal Annealing ◽  
Cross Section ◽  
Rapid Thermal Annealing ◽  
Single Crystal Silicon ◽  
High Dose ◽  
Crystal Silicon ◽  
Polysilicon Films ◽  
P Type

AbstractHighly conductive p+-polysilicon films were fabricated over Si(100) and SiO2 surfaces using high-dose ion implantation and rapid thermal annealing. Resistivities close to that of single crystal silicon were achieved. These films were characterized by a variety of electrical and optical techniques as well as SIMS and cross-section TEM.

scholarly journals Определение концентрации свободных носителей заряда в легированных бором кремниевых нанонитях при помощи инфракрасной спектроскопии в режиме нарушенного полного внутреннего отражения

2019 ◽  
Vol 53 (11) ◽  
pp. 1557
Author(s):  
Е.А. Липкова ◽  
А.И. Ефимова ◽  
К.А. Гончар ◽  
Д.Е. Преснов ◽  
А.А. Елисеев ◽  
...  
Keyword(s):  
Silicon Nanowires ◽  
Annealing Temperature ◽  
Hole Concentration ◽  
Free Charge Carrier ◽  
Transverse Dimension ◽  
Charge Carrier Concentration ◽  
Attenuated Total Reflection ◽  
Free Charge ◽  
Free Hole ◽  
P Type

Attenuated total reflection infrared spectroscopy was used to determine the free charge carrier concentration in the arrays of silicon nanowires of characteristic transverse dimension of 50–100 nm and the length of the order of 10 μm which were formed on low-doped crystalline p-type silicon via metal-stimulated chemical etching and subjected to additional thermodiffusion boron doping at the temperatures 850–1000 оС. It was found out that the free hole concentration varies from 5•1018 to 3•1019 cm-3 depending on the annealing temperature and reaches it’s maximum at 900–950 оС. The results can be used to expand the scope of silicon nanowires application in photonics, sensorics and thermoelectric power converters.

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