Marker Experiments for the moving Species in Silicides During Solid Phase Epitaxy of Evaporated Si

1983 ◽  
Vol 25 ◽  
Author(s):  
Chuen-Der Lien ◽  
Meir Bartur ◽  
Marc-A. Nicolet
Keyword(s):  
Nuclear Reaction ◽  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Silicide Formation ◽  
Si Substrate ◽  
Marker Position

ABSTRACTEvaporated W, implanted Xe, and implanted 18O were used as markers to study the dominant moving species during (a) solid phase epitaxy (SPE) of evaporated Si, (b) silicide formation, and (c) oxidation of silicides on Si substrate.MeV 4He+ backscattering spectrometry and 18O (p, α)15 N nuclear reaction were used to monitor the evolution of elemental profiles as well as the change in the marker position. In most cases, the dominant moving species in SPE is the same as that observed in the formation and oxidation of that silicide. However, in CrSi2 the dominant moving species is Si during silicide formation, but Cr during SPE or oxidation.

Ge epilayer of high quality on a Si substrate by solid‐phase epitaxy

1993 ◽  
Vol 63 (10) ◽  
pp. 1405-1407 ◽  
Author(s):  
W. S. Liu ◽  
J. S. Chen ◽  
D. Y. C. Lie ◽  
M.‐A. Nicolet
Keyword(s):  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Si Substrate ◽  
High Quality

An Influence of the Si(111)3-4o Vicinal Surface on the Solid Phase Epitaxy of α-FeSi2 Nanorods and their Crystal Parameters

2019 ◽  
Vol 806 ◽  
pp. 30-35
Author(s):  
Nikolay Gennadievich Galkin ◽  
Konstantin N. Galkin ◽  
Sergei Andreevich Dotsenko ◽  
Dmitrii L'vovich Goroshko ◽  
Evgeniy Anatolievich Chusovitin ◽  
...  
Keyword(s):  
Direct Evidence ◽  
Solid Phase ◽  
Iron Silicide ◽  
Solid Phase Epitaxy ◽  
Vicinal Surface ◽  
Si Substrate ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Spe Method ◽  
First Time

The morphology and structure of iron silicide nanorods formed on Si (111) vicinal surface by the SPE method at T = 630 °C were studied. Optimal Fe coverage and Fe deposition rate for the formation of a dense array of the nanorods (54-65% of the substrate area) on Si (111) surface with 3-4o miscut angles were established. The aspect ratio of the nanorods is 1.9 – 3.3. Cross-sectional images of a high-resolution transmission electron microscopy (HRTEM) have shown that the nanorods have α-FeSi2 crystal structure. They are strained along the “a” axis and stretched along the “c” axis, which increased the unit cell volume by 10.3%. According to HRTEM image analysis, the nanorods have the following epitaxial relationships: α-FeSi2[01]//Si [10] and α-FeSi2(112)//Si (111). All the data obtained have provided, for the first time, a direct evidence of α-FeSi2 nanorods formation on Si (111) vicinal surface without noticeable penetration of Fe atoms into the Si substrate.

Investigation on solid phase epitaxy of deposited SiGe film on a Si substrate

1997 ◽  
Vol 293 (1-2) ◽  
pp. 310-314 ◽  
Author(s):  
Wen-Jie Qi ◽  
Bing-Zong Li ◽  
Guo-Bao Jiang ◽  
Zhi-Guang Gu ◽  
T.K. Kwok ◽  
...  
Keyword(s):  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Si Substrate

Self-Organization of Cobalt-Silicide Nanoislands on Stepped Si(111) as a Function of Growth Method

2008 ◽  
Vol 8 (2) ◽  
pp. 801-805 ◽  
Author(s):  
I. Goldfarb ◽  
M. Levinshtein
Keyword(s):  
Size Effects ◽  
Room Temperature ◽  
Solid Phase ◽  
Self Organization ◽  
Solid Phase Epitaxy ◽  
Silicide Formation ◽  
Reactive Deposition ◽  
Growth Method ◽  
Single Electron Devices ◽  
Growth Methods

When silicides, such as CoSi2, are grown in the form of nanoislands they frequently exhibit nanometer size effects, which can be useful for single electron devices. For such devices, however, lateral self-organization is required. In this work, step-aided self-organization of CoSi2 nanoislands is demonstrated on a vicinal (stepped) Si(111) substrate. Straight and equidistant steps or step-bunches are routinely obtained on the vicinal Si(111), creating almost ideal template for self-organization. Two growth methods were examined: solid-phase epitaxy (SPE), where Co was deposited at room temperature and annealed to promote silicide formation, and reactive deposition epitaxy (RDE) where Co was deposited at elevated temperature. While the latter did not result in any noticeable ordering, due to instantaneous reaction with Si in course of deposition, the former lead to preferential occupation of step-bunch sites by the silicide nanoislands. Furthermore, self-limiting growth caused narrow distribution of island sizes and island–island separation distances.

Formation and Relaxation of Ni(Au) Disilicide

1995 ◽  
Vol 402 ◽  
Author(s):  
D. Mangelinck ◽  
P. Ga ◽  
J. M. Gay ◽  
B. Pichaud
Keyword(s):  
Rutherford Backscattering Spectrometry ◽  
Solid Phase ◽  
Lattice Parameters ◽  
Solid State Reactions ◽  
Solid Phase Epitaxy ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
X Ray ◽  
Au Clusters ◽  
Relaxation Modes

AbstractThe formation and the relaxation of NiSi2 films with and without Au are examined by scanning electron microscopy, X-ray diffraction and Rutherford backscattering spectrometry. We studied the solid state reactions between a Ni(7 at.% Au) thin film and a Si substrate which occurs during the solid phase epitaxy before the formation of NiSi2. We show that the addition of Au to the Ni film drastically affects the silicides formation: Ni2Si and NiSi appear simultaneously and the nucleation temperature of NiSi 2 is lowered. The solubility of Au in the three silicides is limited which induces a precipitation of Au. Depending on temperature this precipitation takes various forms: Au enriched surface layer or Au clusters at inner interfaces. The films lattice parameters both parallel and perpendicular to the interface are also measured and compared to the lattice parameters of bulk samples which have been made by solidification from the melt. The relaxation modes are deduced from these measurements.

Study of the Crystalline to Amorphous Silicon Boundary Following Laser Induced Solid Phase Epitaxy.

1981 ◽  
Vol 4 ◽  
Author(s):  
J. P. Gonchond ◽  
G. A. Rozgonyi ◽  
D. Bois
Keyword(s):  
Chemical Etching ◽  
Laser Annealing ◽  
Solid Phase ◽  
Electrical Activation ◽  
Solid Phase Epitaxy ◽  
Si Substrate ◽  
Implantation Damage ◽  
Cw Laser ◽  
Higher Power ◽  
Voltage Contrast

ABSTRACTEBIC and voltage contrast SEM microscopy, combined with optical microscopy. chemical etching and Talystep profiling have been used to investigate cw laser annealing of a-Si in the slip-free SPE regime. Special attention is devoted to the edges and extremities of the line scans, i.e. to the c-to a-Si boundary. At very low power, evidence is given for an initial reordering and thus electrical activation stage of the a-Si. For the higher power range regrowth occurs through two different processes. The EBIC yield is interpreted in terms of a balance between annealing of the ion implantation damage and defect generation in the si substrate during the laser annealing. These results are extended to the case of a scanned electron beam annealing.

Al-mediated Solid-Phase Epitaxy of Silicon-On-Insulator

2010 ◽  
Vol 1245 ◽  
Author(s):  
Agata Sakic ◽  
Yann Civale ◽  
Lis K. Nanver ◽  
Cleber Biasotto ◽  
Vladimir Jovanovic
Keyword(s):  
Silicon Dioxide ◽  
Amorphous Silicon ◽  
Crystal Orientation ◽  
Solid Phase ◽  
Silicon On Insulator ◽  
Solid Phase Epitaxy ◽  
Si Substrate ◽  
High Quality ◽  
Lateral Overgrowth

AbstractSilicon-on-insulator (SOI) regions have been grown on lithographically predetermined positions by Al-mediated Solid-Phase Epitaxy (SPE) of amorphous silicon (α-Si). A controllable Si lateral overgrowth is induced from windows formed in silicon dioxide (SiO2) to the crystalline Si substrate. The resulting hundred of-nanometer large areas of high-quality monocrystalline SOI are formed at the temperatures that can be as low as 400 °C. The as-obtained SOI regions were found to take on the same crystal orientation as the (100) Si substrate and have the ability to merge seamlessly over the oxide.

Ge Transport and Epitaxy on [111] Si in the Ge/Pd2Si/Si System

1989 ◽  
Vol 160 ◽  
Author(s):  
Q. Z. Hong ◽  
J. G. Zhu ◽  
W. Xia ◽  
J. W. Mayer
Keyword(s):  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Si Substrate ◽  
Temperature Range ◽  
Minimum Yield

AbstractSolid phase epitaxy in the amorphous(a)-Ge/Pd2Si/Si system has been investigated in the temperature range of 600 to 750 °C. The top Ge started to migrate into the suicide layer at 600 °C. After longer time annealing the mixed Ge released from the suicide matrix and formed a laterally uniform epitaxial Ge70Si30 layer on the [111] Si substrate. A minimum yield of 0.1 was achieved for a 800 Å-thick Ge70Ge30 layer.

Rapid Thermal Annealing of GaAs Films on (001) Si Substrate Grown by Solid Phase Epitaxy Technique

1990 ◽  
Vol 202 ◽  
Author(s):  
W.K. Choo ◽  
K.I. Cho ◽  
J.Y. Lee ◽  
S.C. Park ◽  
O.J. Kwon
Keyword(s):  
Solid Phase ◽  
Substantial Improvement ◽  
Misfit Dislocations ◽  
Solid Phase Epitaxy ◽  
Si Substrate ◽  
Rapid Thermal Anneal ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Distributed Array ◽  
Gaas Films

ABSTRACTGaAs layers grown by solid phase epitaxy on (001) Si substrate were subjected to post-growth rapid thermal anneal (RTA) at 700, 800, and 900°C for 10s in a N2 atmosphere. Rutherford backscattering/channeling showed a substantial improvement in crystalline quality of GaAs epilayer after RTA at 800°C. After RTA at 900°C for 10s, stacking faults (and/or microtwins) were eliminated entirely, and the dislocation densities in both the interface region and the film interior were reduced. High-resolution transmission electron micrographs showed a significant change in misfit dislocation structure at the interface after RTA; namely, the 90° pure edge and 60° misfit dislocations were transformed to an evenly distributed array of 90° dislocations at the interface.

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