Mechanical Properties of Porous MSQ Films: Impact of the Porogen Loading and Matrix Crosslinking.

2005 ◽  
Vol 863 ◽  
Author(s):  
F. Ciaramella ◽  
V. Jousseaume ◽  
S. Maitrejean ◽  
B. Rémiat ◽  
M. Verdier ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Integrated Circuits ◽  
Dielectric Material ◽  
Semiconductor Industry ◽  
Young Modulus ◽  
High Porosity ◽  
Porous Films ◽  
K Value ◽  
Porosity Level ◽  
Before And After

AbstractSemiconductor industry needs a continuously improvement of integrated circuits performance and an increase of integrated density on silicon. The 2004 ITRS Roadmap underlines the need of dielectric material for ILD with dielectric constant (k) lower than 3 for the 90 nm node and than 2.4 for the 45 nm node. In this work, porous films with k value lower than 2.2 were processed using a porogen approach. Firstly, a material composed of a methylsilsesquioxane (MSQ) matrix and of organic nanoparticles (called porogen) is deposited and baked. Then, this composite is thermally cured to allow the porogens degradation and matrix crosslinking. Different k values were obtained by varying the porogen loading in the composite. Mechanical properties of composite and porous films (before and after porogen removal respectively) were investigated using nanoindentation and FTIR analysis for different porogen loadings (between 0 and 40 %). The composite modulus is higher than the porous film modulus for high porogen loading. This result is interpreted in term of matrix crosslinking. Mechanical properties were also modelized using foam mechanical models. For high porosity level, the best Young modulus fitting is obtained with tetrakaidecaedric cells, which seems in good agreement with porosity morphology.

Study of Porous Silica Based Films as Low-k Dielectric Material and their Interface with Copper Metallization

2002 ◽  
Vol 716 ◽  
Author(s):  
Ilanit Fisher ◽  
Wayne D. Kaplan ◽  
Moshe Eizenberg ◽  
Michael Nault ◽  
Timothy Weidman
Keyword(s):  
Integrated Circuits ◽  
Dielectric Material ◽  
Hydrogen Plasma ◽  
Porous Silica ◽  
Film Deposition ◽  
Copper Metallization ◽  
High Porosity ◽  
Tem Analysis ◽  
Chip Technology ◽  
Low K

AbstractThe success of future gigascale integrated circuits (IC) chip technology depends critically upon the reduction of the interconnects RC delay time. This calls for the development of new low dielectric constant (low-k) insulators, and for work on their integration with lower resistivity copper metallization.A porous silica based film prepared by surfactant templated self-assembly spin-on deposition (SOD) is an attractive candidate as a low-k material. In this research we have studied the structure, chemical composition and bonding of the film and its interface with copper metallization. The decomposition and vaporization of the surfactant in the last step of film deposition resulted in a film with an amorphous structure, as determined by XRD and TEM analysis. Its high porosity (35-58%) was confirmed by XRR and RBS measurements. XPS analysis of the Si2p transition indicated three types of bonding: Si-O, O-Si-C and Si-C. The bonding characteristics were also investigated by FTIR analysis. The effect of a hydrogen plasma post-treatment process on the film topography and bonding was determined by AFM and XPS, respectively. It was found that direct H2 plasma exposure significantly affected the surface roughness of the film and type of chemical bonding. The structure and properties of various PECVD deposited capping layers were also studied, as was the interface between the porous dielectric and Ta, TaxN and Cu (PVD deposited films) after annealing at 200-700°C in vacuum environment for 30 min. At temperatures up to 500°C, no significant diffusion of Cu or Ta into the porous film was detected, as determined by RBS. No copper penetration was detected up to 700°C, according to AES and SIMS analysis. However, at 700°C copper dewetting occurred when it was deposited directly on the porous silica based film.

scholarly journals PRGF-Modified Collagen Membranes for Guided Bone Regeneration: Spectroscopic, Microscopic and Nano-Mechanical Investigations

2019 ◽  
Vol 9 (5) ◽  
pp. 1035 ◽  
Author(s):  
Cristian Ratiu ◽  
Marcel Brocks ◽  
Traian Costea ◽  
Liviu Moldovan ◽  
Simona Cavalu
Keyword(s):  
Mechanical Properties ◽  
Bone Regeneration ◽  
Enzymatic Degradation ◽  
Young Modulus ◽  
Guided Bone Regeneration ◽  
Fiber Density ◽  
New Approach ◽  
Before And After ◽  
Collagen Membranes ◽  
Membrane Type

The aim of our study was to evaluate the properties of different commercially available resorbable collagen membranes for guided bone regeneration, upon addition of plasma rich in growth factors (PRGF). The structural and morphological details, mechanical properties, and enzymatic degradation were investigated in a new approach, providing clinicians with new data in order to help them in a successful comparison and better selection of membranes with respect to their placement and working condition. Particular characteristics such as porosity, fiber density, and surface topography may influence the mechanical behavior and performances of the membranes, as revealed by SEM/AFM and nanoindentation measurements. The mechanical properties and enzymatic degradation of the membranes were analyzed in a comparative manner, before and after PRGF-modification. The changes in Young modulus values are correlated with the ultrastructural properties of each membrane type. The enzymatic (trypsin) degradation test also emphasized that PRGF-modified membranes exhibit a slower degradation compared to the native ones.

scholarly journals SEPARATION OF THE INTER- AND INTRA-PARTICLE POROSITY IN IMAGES OF POWDER COMPACTS

2011 ◽  
Vol 21 (3) ◽  
pp. 183
Author(s):  
Jacques Lacaze ◽  
Alexis Arnal ◽  
Jean-Luc Dupuy ◽  
Dominique Poquillon
Keyword(s):  
Mechanical Properties ◽  
Powder Metallurgy ◽  
Satisfactory Agreement ◽  
Compaction Pressure ◽  
High Porosity ◽  
Porosity Level ◽  
Iron Powders ◽  
Cheap Method ◽  
Two Parameters ◽  
Powder Compacts

Powder metallurgy is a highly developed and cheap method of manufacturing reliable materials, either metallic, ceramic or composite. This process was used to make green compacts of iron powders with a high porosity level. This study is part of a project aimed at describing the relationships between mechanical properties and morphological features of such compacts, with particular attention paid to the shape of the grains and the compaction pressure. In this report, a method is proposed to separate the intra grain porosity from the cavities located between particles. The approach is based on the covariogram of images obtained from the surface of the compacts by means of a laser roughometer. To achieve this separation, a model of the structure is proposed which assumes that the distributions of the grains and of the intra-particle cavities are random and independent. Each distribution is characterized by two parameters. A satisfactory agreement is obtained between experimental and calculated covariograms after identification of these parameters.

Non-Destructive Characterization of Cement Materials Using Ultrasonic Method - Application to the Study of Carbonation

2014 ◽  
Vol 1065-1069 ◽  
pp. 1791-1794 ◽  
Author(s):  
Son Tung Pham
Keyword(s):  
Mechanical Properties ◽  
Ultrasonic Method ◽  
Construction Materials ◽  
Young Modulus ◽  
Cementitious Materials ◽  
Margin Of Error ◽  
Before And After ◽  
Non Destructive ◽  
Non Destructive Characterization

The objective of this study is to realize a non-destructive characterization of cementitious materials using ultrasonic method. The motivation of our work is to show that the ultrasound can be applied not only in medical imaging but also in the assessment of construction materials, which is not widely known in this domain. In order to solve the problem, the ultrasonic velocity measurement was performed on the samples before and after carbonation of a standardized mortar at different periods. The results offer the possibility to determine the mechanical properties such as Young modulus E, shear modulus G and Poisson's ratio. This is an advantage for in-situ structures in comparison with destructive methods that require destroying the samples. The main contributions of this study are: 1) Ultrasonic occultation of cement materials is a reliable method with a small margin of error; 2) The values ​​of mechanical properties found by ultrasonic method are consistent with theoretical values ​​found in the literature; 3) The evolution of these mechanical properties is consistent with the densification of the microstructure during carbonation due to the formation of CaCO3.

scholarly journals Multifunctional Platform Based on Electroactive Polymers and Silica Nanoparticles for Tissue Engineering Applications

2018 ◽  
Author(s):  
Sylvie Ribeiro ◽  
Tânia Ribeiro ◽  
Clarisse Ribeiro ◽  
Daniela M. Correia ◽  
João P. Sequeira Farinha ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Tissue Engineering ◽  
Silica Nanoparticles ◽  
Polymer Matrix ◽  
Vinylidene Fluoride ◽  
Young Modulus ◽  
Filler Concentration ◽  
Thermal And Mechanical Properties ◽  
Porous Films ◽  
Engineering Applications

Poly(vinylidene fluoride) nanocomposites processed with different morphologies, such as porous and non-porous films and fibres, have been prepared with silica nanoparticles (SiNPs) of varying diameter (17, 100, 160 and 300 nm) which in turn have encapsulated perylenediimide (PDI), a fluorescent molecule. Structural, morphological, optical, thermal, and mechanical properties of the nanocomposites, with SiNP filler concentration up to 16 wt% were evaluated. Further, cytotoxicity and cell proliferation studies were performed. All SiNPs are negatively charged independently of the pH and more stable from pH 5 upwards. The SiNPs introduction within the polymer matrix increases the contact angle independently of the nanoparticle diameters and the smallest ones (17 nm) improve the PVDF Young modulus from 0.94 ± 0.04 GPa for the pristine polymer film to 1.05 ± 0.06 GPa. Varying filler diameter, physico-chemical, thermal and mechanical properties of the polymer matrix were not significantly affected. Finally, the SiNPs inclusion does not induce cytotoxicity in murine myoblasts (C2C12) after 72 h of contact and proliferation studies reveal that the prepared composites represent a suitable platform for tissue engineering applications, as they allow to combine the biocompatibility and piezoelectricity of the polymer with the possible functionalization and drug encapsulation and release of the SiNP.

Modeling and Measurement of the Effective Young Modulus of Porous Biomedical Materials Manufactured via SLM

2014 ◽  
Vol 606 ◽  
pp. 125-128 ◽  
Author(s):  
David Joguet ◽  
Yoann Danlos ◽  
Rodolphe Bolot ◽  
Ghislain Montavon ◽  
Christian Coddet
Keyword(s):  
Mechanical Properties ◽  
Process Parameters ◽  
Pure Titanium ◽  
Young Modulus ◽  
Bending Test ◽  
Mechanical Resistance ◽  
Layer By Layer ◽  
Cross Sectional ◽  
Porosity Level ◽  
Effective Mechanical Properties

Selective Laser Melting (SLM) has become a widely used process for manufacturing metal part prototypes. This process, also known as additive manufacturing or rapid prototyping, allows the production of complex pieces using a layer by layer technology. Each layer is build by a laser irradiation providing a local melting (and resolidification) of a thin powder bed presenting a thickness of a few tens of microns. In the present work, two different materials used in biomedical applications were processed by SLM (namely pure titanium and Co28Cr6Mo alloy). The process parameters were set in order to adjust the materials porosity levels. The influence of the porosity level on the material effective mechanical properties was then quantified by experimental measurements using a two point bending test and by applying numerical modeling. The numerical model is based on the use of cross-sectional SEM micrographs of the material. These micrographs were used as meshes (each pixel is a FEM element) and the ANSYS software was then used to perform virtual loadings on the material with the objective to provide its effective mechanical properties. A comparison of the predicted and measured Young modulus was then performed. The provided results confirm that the process parameters may be adjusted in order to control the porosity level of the material and subsequently to adjust its effective mechanical resistance.

scholarly journals Introduction of Laser Pi-Grooving as Breakthrough Solution to Enhance die Strength of 40 nm ulow-k CMOS Silicon Technology during Wafer Saw Process

2021 ◽  
pp. 26-36
Author(s):  
Aiza Marie E. Agudon ◽  
Hynlie B. Inguin ◽  
Bryan Christian S. Bacquian
Keyword(s):  
Integrated Circuits ◽  
New Technologies ◽  
Process Development ◽  
Dielectric Material ◽  
Semiconductor Industry ◽  
Silicon Technology ◽  
Everyday Activities ◽  
New Process ◽  
Low K ◽  
Standard Laser

Nowadays, semiconductors and electronics are becoming part of our everyday activities. As the Integrated circuits become more useful to people, it also requires more function, which contain more complex and compact components. Aligned to this package requirement, the more challenging it become to package development as Silicon technology becomes more critical and complex from bare silicon to conventional MOS technology to Ultra Low-K, which requires a different strategy.  The new process development in the Semiconductor industry is a necessity to cope up with these new technologies. Low-k devices always pose a big challenge in achieving good dicing quality. This is because of the weak mechanical properties of the low-k dielectric material used.  Mechanical Sawing is the most popular cutting method for silicon, but with Ultra low-K technology, using mechanical sawing will lead to various sawing defects such as chippings and delamination [1,2]. These leads to the introduction of Laser Grooving to get rid of these dilemmas. Laser grooving uses heat to eradicate metals on this very thin metal wafer dicing saw streets in preparation for wafer saw process to prevent topside chippings and delamination/metal peel off [3]. These defects are not acceptable especially since the product application is a chip card. Since chip cards must be flexible and durable, they require higher die and package strength to serve its purpose. To achieve such package requirement, different method was evaluated such as standard mechanical dicing, standard Laser Grooving and the PI laser groove.   The paper will discuss how we were able to achieve the quality requirement for Ultra Low-K and at the same time eliminating top reject contributor during startup of this device.

scholarly journals Mechanical Properties and Microstructure of DMLS Ti6Al4V Alloy Dedicated to Biomedical Applications

Materials ◽  
2019 ◽  
Vol 12 (1) ◽  
pp. 176 ◽  
Author(s):  
Żaneta Anna Mierzejewska ◽  
Radovan Hudák ◽  
Jarosław Sidun
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Boundary Effect ◽  
High Porosity ◽  
Elongation At Break ◽  
Horizontal Orientation ◽  
Before And After ◽  
Columnar Grains ◽  
Powder Particles ◽  
Selection Of

The aim of this work was to investigate the microstructure and mechanical properties of samples produced by direct metal laser sintering (DMLS) with varied laser beam speed before and after heat treatment. Optical analysis of as-built samples revealed microstructure built of martensite needles and columnar grains, growing epitaxially towards the built direction. External and internal pores, un-melted or semi-melted powder particles and inclusions in the examined samples were also observed. The strength and Young’s modulus of the DMLS samples before heat treatment was higher than for cast and forged samples; however, the elongation at break for vertical and horizontal orientation was lower than required for biomedical implants. After heat treatment, the hardness of the samples decreased, which is associated with the disappearance of boundary effect and martensite decomposition to lamellar mixture of α and β, and the anisotropic behaviour of the material also disappears. Ultimate tensile strength (UTS) and yield strength(YS) also decreased, while elongation increased. Tensile properties were sensitive to the build orientation, which indicates that DMLS generates anisotropy of material as a result of layered production and elongated β prior grains. It was noticed that inappropriate selection of parameters did not allow properties corresponding to the standards to be obtained due to the high porosity and defects of the microstructure caused by insufficient energy density.

Wafer Cleaning Influence on the Roughness of the Si/SiO2 Interface

1995 ◽  
Vol 386 ◽  
Author(s):  
A. Munkholm ◽  
S. Brennan ◽  
Jon P. Goodbread
Keyword(s):  
Integrated Circuits ◽  
Semiconductor Industry ◽  
Native Oxide ◽  
X Ray Scattering ◽  
Wafer Cleaning ◽  
Thermal Oxide ◽  
Before And After ◽  
The Difference ◽  
Cleaning Methods

ABSTRACTThe roughness of the Si/SiO2 interface has a great impact on the electrical properties of the gate-oxide in integrated circuits and consequently it is a large concern for the semiconductor industry. As the thickness of the oxide is decreased, the role of the roughness becomes more critical for the device. The nature of a buried interface prohibits the use of commonly used surface techniques. By the use of crystal truncation rod (CTR) x-ray scattering, it is possible to get information on the termination of the bulk silicon in a nondestructive fashion. The authors have investigated the influence of different cleanings on interfacial roughness using synchrotron radiation-based CTR-scattering. In particular, we looked at silicon(001) wafers both before and after the growth of a 1000Å thermal oxide. The results show that the use of HF during cleaning results in a smoother interface between silicon and its native oxide. Due to smoothing of the interface during the oxidation process, the difference between the various cleaning methods becomes less significant for these thick oxides.

Mechanical Characterization of Multilayer Thin Film Stacks Containing Porous Silica Using Nanoindentation and the Finite Element Method

2005 ◽  
Vol 875 ◽  
Author(s):  
Ke Li ◽  
Subrahmanya Mudhivarthi ◽  
Sunil Saigal ◽  
Ashok Kumar
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Finite Element ◽  
Integrated Circuits ◽  
Dielectric Material ◽  
Porous Silica ◽  
Homogenization Method ◽  
Fe Model ◽  
Multilayer Thin Film

AbstractNovel metal/dielectric material combinations are becoming increasingly important for reducing the resistance-capacitance (RC) interconnection delay within integrated circuits (ICs) as the device dimensions shrink to the sub-micron scale. Copper (Cu) is the material of choice for metal interconnects and SiO2 (with a dielectric constant k = ∼ 3.9) has been used as an interlevel dielectric material in the industry. To meet the demands of the international road map for semiconductors, materials with a significantly lower dielectric constant are needed. In this study, the effects of porosity and layer thicknesses on the mechanical properties of a multilayer thin film (Cu, Ta and SiO2)-substrate (Si) system are examined using nanoindentation and finite element (FE) simulations. A micromechanics model is first developed to predict the stress-strain relation of the porous silica based on the homogenization method for composite materials. An FE model is then generated and validated to perform a parametric study on nanoindentation of the Cu/Ta/SiO2/Si system aiming to predict the mechanical properties of the multilayer film stack.

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