scholarly journals Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Energies ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2176
Author(s):  
Ali Roshanghias ◽  
Perla Malago ◽  
Jaroslaw Kaczynski ◽  
Timothy Polom ◽  
Jochen Bardong ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Management ◽  
Electrical Contact ◽  
Power Electronic ◽  
Power Module ◽  
Element Analysis ◽  
Ohmic Losses ◽  
Die Attach ◽  
Wire Bonds

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages.

scholarly journals Investigation on Die Crack in a Stacked Die Package Using Finite Element Analysis

2021 ◽  
pp. 83-91
Author(s):  
Jefferson Talledo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Coefficient Of Thermal Expansion ◽  
Crack Problem ◽  
Element Analysis ◽  
Robust Solution ◽  
Die Attach ◽  
Die Stress ◽  
Cte Mismatch ◽  
Semiconductor Packages

Die crack is one of the problems in stacked die semiconductor packages. As silicon dies become thinner in such packages due to miniaturization requirement, the tendency to have die crack increases. This study presents the investigation done on a die crack issue in a stacked die package using finite element analysis (FEA). The die stress induced during the package assembly processes from die attach to package strip reflow was analyzed and compared with the actual die crack failure in terms of the location of maximum die stress at unit level as well as strip level. Stresses in the die due to coefficient of thermal expansion (CTE) mismatch of the package component materials and mechanical bending of the package in strip format were taken into consideration. Comparison of the die stress with actual die crack pointed to strip bending as the cause of the problem and not CTE mismatch. It was found that the die crack was not due to the thermal processes involved during package assembly. This study showed that analyzing die stress using FEA could help identify the root cause of a die crack problem during the stacked die package assembly and manufacturing as crack occurs at locations of maximum stress. The die crack mechanism can also be understood through FEA simulation and such understanding is very important in coming up with robust solution.

Electro-thermal finite element analysis and verification of power module with aluminum wire

2014 ◽  
Vol 120 ◽  
pp. 114-120 ◽  
Author(s):  
Li-Ling Liao ◽  
Tuan-Yu Hung ◽  
Chun-Kai Liu ◽  
Wei Li ◽  
Ming-Ji Dai ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Aluminum Wire ◽  
Power Module ◽  
Element Analysis

Finite Element Analysis of Thermal Management in Optical Pumping Semiconductor Vertical-External Cavity Surface-Emitting Laser

2009 ◽  
Vol 36 (10) ◽  
pp. 2745-2750
Author(s):  
陈柏众 Chen Baizhong ◽  
戴特力 Dai Teli ◽  
梁一平 Liang Yiping ◽  
秦莉 Qin Li ◽  
赵红 Zhao Hong ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Management ◽  
Optical Pumping ◽  
External Cavity ◽  
Cavity Surface ◽  
Element Analysis ◽  
Surface Emitting Laser

scholarly journals Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

Materials ◽  
2017 ◽  
Vol 10 (7) ◽  
pp. 739 ◽  
Author(s):  
Muhammad Zain-ul-abdein ◽  
Hassan Ijaz ◽  
Waqas Saleem ◽  
Kabeer Raza ◽  
Abdullah Salmeen Bin Mahfouz ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Management ◽  
Interfacial Debonding ◽  
Element Analysis

scholarly journals Thermal Resistance Matrix Extraction from Finite-Element Analysis for High-Frequency Magnetic Components

Energies ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 3075
Author(s):  
Guillermo Salinas ◽  
Juan A. Serrano-Vargas ◽  
Javier Muñoz-Antón ◽  
Pedro Alou
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Resistance ◽  
Thermal Management ◽  
High Frequency ◽  
Absolute Error ◽  
Element Analysis ◽  
Magnetic Components ◽  
3D Fea ◽  
Resistance Matrix

The thermal management of magnetic components for power electronics is crucial to ensure their reliability. However, conventional thermal models for magnetic components are known to have either poor accuracy or excessive complexity. Contrary to these models, the use of Thermal Resistance Matrices is proposed in this paper instead, which combine both accuracy and simplicity. They are usually used to characterize semiconductor devices, but not for magnetic components. The guidelines to apply Thermal Resistance Matrices for magnetic components are discussed in detail. The accuracy of this model is validated by 3D FEA simulations and experimental results, showing an absolute error lower than 5 ∘C and a relative error between −6.4% and 3.9%, which is outstanding compared to the carried-out literature review.

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