Mechanical Properties and Solderability of Robust Sn-0.7Cu Lead-Free Composite Solder

2015 ◽  
Vol 754-755 ◽  
pp. 556-560 ◽  
Author(s):  
Sayyidah Amnah Musa ◽  
Norainiza Saud ◽  
Nurul Razliana Abdul Razak ◽  
Kamarudin Hussin
Keyword(s):  
Mechanical Properties ◽  
Contact Angle ◽  
Activated Carbon ◽  
Composite Solder ◽  
Solder Matrix ◽  
Lead Free ◽  
Electronic Application ◽  
Sintered Composite ◽  
Reliability Performance ◽  
Hardness Values

A composite solder with Sn-0.7Cu based solder was successfully fabricated via powder metallurgy routes which consist of mixing, compacting and sintering. Varying amount of activated carbon (AC) was used as reinforcement to obtain a novel lead-free composite solder. Following fabrication, the sintered composite solder was analyzed in terms of their microstructure, microhardness and solderability properties. The distribution of the various percentages of AC particles along the grain boundaries was observed. The addition of AC particles into the Sn-0.7Cu solder matrix has increased the hardness values up to 22.9%, while reducing the contact angle of composite solder up to 12.9% for a good wettability performance. As overall, addition of AC into Sn-0.7Cu based solder has indicated an enhancement of reliability performance of Sn-0.7Cu/AC composite solder for electronic application.

Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method

2015 ◽  
Vol 754-755 ◽  
pp. 513-517
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Rita Mohd Said ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Activated Carbon ◽  
Powder Metallurgy ◽  
Solder Alloy ◽  
Composite Solder ◽  
Microstructural Analysis ◽  
The Other ◽  
Powder Metallurgy Method ◽  
Micron Size ◽  
Carbon Additions

Composite solder has drawn attention improvement in microstructural modification and mechanical properties. This research was done to investigate the influence of activated carbon (AC) particulate on the commercial Sn-Cu-Ni solder system (SN100C) solder alloy. The SN100C+AC composite solder was fabricated via powder metallurgy (PM) technique. In this study, five different AC compositions were chosen; (0, 0.25, 0.5, 0.75 and 1.0 wt. %. This study has shown that composite solder has better properties compared to the monolithic solder alloy. A small amount of AC particulate had improved the physical properties of the composite solder. Microstructural analysis showed that the reinforcement was well distributed along the grain boundaries and no significant influence on the melting point of SN100C. Apart from that, 1.0 wt. % of AC additions results with the highest hardness value compared to the other composition.

Enhancement of Microstructural and Physical Properties of Sn-0.7Cu Lead-Free Solder with the Addition of SiC Particles

2018 ◽  
Vol 280 ◽  
pp. 181-186
Author(s):  
Z. Mahim ◽  
Nurul Razliana Abdul Razak ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Norainiza Saud
Keyword(s):  
Mechanical Properties ◽  
Physical Properties ◽  
Composite Solder ◽  
Physical And Mechanical Properties ◽  
Lead Free ◽  
Attractive Alternative ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
Free Solder ◽  
Sic Particle

Nowadays, composite solder has gained researcher’s attention due to its promising improvement in physical and mechanical properties for lead-free solder. To improve the properties of Sn-0.7Cu (SnCu): the promising lead-free candidate, addition of silicon carbide (SiC) as a reinforcement was used into this study. However, its limitation on solderability as compared with SnAgCu (SAC) make it not an attractive alternative lead-free solder. This study was carried out to investigate the effect of SiC particle on microstructure evolution and physical properties of SnCu based solder alloys. SnCu-SiC composite solders were synthesized by powder metallurgy method (PM), which consists of several processes such as mechanical blending, compaction and sintering. Five different weight percentages of SiC particle; 0.00, 0.25, 0.50, 0.75 and 1.00 were mechanically blended with SnCu lead-free solder. The result shows that the addition of SiC particle has decreased the β-Sn area and refined the microstructure of composite solder. In addition, the improvement in microhardness of composite was achieved.

scholarly journals Microstructure and mechanical properties of lead-free Sn-Cu-Ni composite solder paste reinforced with silicon (Si) particles

2017 ◽  
Author(s):  
R. M. Said ◽  
M. A. A. Mohd Salleh ◽  
M. I. I. Ramli ◽  
N. Saud ◽  
M. M. Al Bakri Abdullah ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Composite Solder ◽  
Lead Free ◽  
Solder Paste ◽  
Microstructure And Mechanical Properties

scholarly journals Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly

2019 ◽  
Vol 16 (1) ◽  
pp. 79-94
Author(s):  
Rizk Mostafa Shalaby ◽  
Fatma Elzahraa Ibrahim ◽  
Mostafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Rare Earth ◽  
Earth Element ◽  
Low Cost ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal And Mechanical Properties ◽  
Electronic Assembly ◽  
Free Solder

This work methodically concentrated on the effect of a trace amount of rare earth element terbium, Tb (0.1, 0.2, 0.3, 0.4 and 0.5 wt. %) on the properties of eutectic Sn-3.5 wt. %Ag were studied. The results indicated that addition of Tb rare earth can be refined the microstructure of the solder and intermetallic compound (IMC) Ag3Sn phase appeared in the solder matrix. Add a few quantity of rare earth Tb enhances the hardness and strength of eutectic Sn-Ag lead free solder joint. Also, results indicate that adding Tb to the eutectic Sn-3.5Ag remarkably enhances solderability, reliability, thermal and mechanical properties. It is also found that increasing in mechanical strength can depend on crystalline size refining in addition to some regular precipitates from IMC, Ag3Sn.

DEVELOPMENT OF NOVEL LEAD-FREE SOLDER COMPOSITES USING CARBON NANOTUBE REINFORCEMENTS

2005 ◽  
Vol 04 (04) ◽  
pp. 423-429 ◽  
Author(s):  
S. M. L. NAI ◽  
M. GUPTA ◽  
J. WEI
Keyword(s):  
Mechanical Properties ◽  
Carbon Nanotubes ◽  
Coefficient Of Thermal Expansion ◽  
Solder Matrix ◽  
Thermomechanical Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Mechanical Properties Characterization ◽  
Made In

In this study, Sn - Ag - Cu based nanocomposites with carbon nanotubes (CNTs) as reinforcements were successfully synthesized via the powder metallurgy technique. Lead-free solder powders were firstly blended together with varying weight percentages of CNTs. The materials were then compacted, sintered and finally extruded at room temperature. The extruded materials were characterized for their microstructural, thermal and mechanical properties. The porosity of the nanocomposites was observed to increase with increasing weight percentages of CNTs, accordingly the density of the nanocomposites was reduced. Thermomechanical analysis of the solder nanocomposites showed that the use of CNTs as reinforcements decreased the average coefficient of thermal expansion of the solder matrix. Furthermore, the results of mechanical properties characterization revealed that the addition of CNTs aids in enhancing the microhardness and the overall strength of the nanocomposite solder. An attempt is made in the present study to correlate the variation in weight percentages of the carbon nanotubes with the properties of the resultant nanocomposite materials.

Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder

2016 ◽  
Vol 700 ◽  
pp. 152-160 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
R.M. Said ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Contact Angle ◽  
Shear Strength ◽  
Silicon Nitride ◽  
Fracture Surface ◽  
Composite Solder ◽  
Thickness Measurement ◽  
Contact Angle Measurement ◽  
Angle Measurement ◽  
Joint Fracture

The wettability and mechanical properties of solder the joint of Sn-Cu-Ni-xSi3N4 had been investigated. In this study, five different silicon nitride (Si3N4) percentage addition were chosen (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). Contact angle measurement demonstrated that with Si3N4 addition, the wetting perfomances had been improved with the decrease of wettability contact angle. It is believed that the Si3N4 particles suppresses the interfacial IMC growth and thus improves the shear strength. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of Si3N4), the higher the shear strength of the joint. Fracture surface of sheared samples shows a combination of both brittle and ductile fracture.

Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder

2012 ◽  
Vol 556 ◽  
pp. 633-637 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
A.M. Mustafa Al Bakri ◽  
M.H. Zan@Hazizi ◽  
Flora Somidin ◽  
Noor Farhani Mohd Alui ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Composite Solder ◽  
Lead Free

scholarly journals Ultrasound-Assisted Surface Modifications on Ceramic Reinforcement for Lead-Free Composite Solders : Short Review

2021 ◽  
Vol 2080 (1) ◽  
pp. 012025
Author(s):  
Wai Keong Leong ◽  
Ahmad Azmin Mohamad ◽  
Muhammad Firdaus Nazeri
Keyword(s):  
Mechanical Properties ◽  
Surface Modification ◽  
Positive Impact ◽  
Solder Matrix ◽  
Surface Modifications ◽  
Short Review ◽  
Lead Free ◽  
Future Research ◽  
Ultrasound Assisted ◽  
Ceramic Reinforcement

Abstract The purpose of this paper is to review and examine the effect of ultrasound-assisted surface modifications of ceramic reinforcements on the properties of lead-free solders. The discussion will highlight the fundamental understanding, main parameters, configurations, and recent surface-modified ceramic reinforced composite lead-free solder developments. The review also identified and summarized the advantages, current trends, and significant findings in this field. The ultrasound-assisted surface modification was found to provide a crucial improvement on the wettability properties of molten solders as the matrix phase on the ceramic reinforcement. Further, the excellent distribution of ceramic reinforcement in solder matrix was also seen after the surface modification process. This has led to significant improvements in mechanical properties such as hardness and strength. The pinning of dislocation movement was seen as the reason for improving the mechanical properties. This positive impact in enhancing the ceramic reinforcement-solder interfacial reaction allows more explicit future research directions and opportunities for composite solder applications.

Improvement of Sn-0.7Cu Lead Free Solder Joints on Shear Strength with Addition of Titanium Oxide (TiO2) Particles

2016 ◽  
Vol 857 ◽  
pp. 68-72
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Titanium Oxide ◽  
Composite Solder ◽  
Microwave Sintering ◽  
Lead Free ◽  
Lead Free Solder ◽  
Composite Solder Joint ◽  
Weight Percentage ◽  
Free Solder

In this paper, Sn-0.7Cu composite containing weight percentage of 1.0 wt. % of titanium oxide (TiO2) particles were successfully fabricated by using the powder metallurgy (PM) route assisted hybrid microwave sintering. This research investigated the effect s of TiO2 particles addition on the interfacial reactions formed between Sn-0.7Cu solder/substrate and shear strength of a Sn-0.7Cu solder alloy. With the increasing of TiO2 particles, Sn-0.7Cu-TiO2 composite solder showed decreasing in thickness value and shear strength was increased. This signified that the presence of TiO2 particles effect on the thickness of Cu6Sn5 IMC layer at the interface and mechanical properties Sn-0.7Cu composite solder joint.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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