Finite Element Analysis on Structural Stress of 16×16 InSb IRFPA with Viscoelastic Underfill

2011 ◽  
Vol 314-316 ◽  
pp. 530-534 ◽  
Author(s):  
Li Wen Zhang ◽  
Jin Chan Wang ◽  
Qian Yu ◽  
Qing Duan Meng
Keyword(s):  
Finite Element ◽  
Maximum Stress ◽  
Viscoelastic Model ◽  
Finite Element Method Simulation ◽  
Von Mises Stress ◽  
Structural Stress ◽  
Element Analysis ◽  
Indium Bump ◽  
Final Yield ◽  
Von Mises

The thermal stress and strain, from the thermal mismatch of neighboring materials, are the major causes of fracture in InSb IRFPA. Basing on viscoelastic model describing underfill, the structural stress of 16×16 InSb IRFPA under thermal shock is studied with finite element method. Simulation results show that as the diameters of indium bump increase from 20μm to 36μm in step of 2μm, the maximum stress existing in InSb chip first increases slightly, and fluctuates near 28µm, then decreases gradually. Furthermore, the varied tendency seems to have nothing to do with indium bump standoff height, and with thicker indium bump height, the maximal Von Mises stress in InSb chip is smaller. All these mean that the thicker underfill is in favor of reducing the stress in InSb chip and improving the final yield.

Finite Element Analysis on Structural Stress of 8×8 InSb Infrared Focal Plane Array

2010 ◽  
Vol 34-35 ◽  
pp. 207-211 ◽  
Author(s):  
Qing Duan Meng ◽  
Xiao Ling Zhang ◽  
Xiao Lei Zhang ◽  
Wei Guo Sun
Keyword(s):  
Finite Element ◽  
Focal Plane ◽  
Maximum Stress ◽  
Focal Plane Array ◽  
Von Mises Stress ◽  
Design Parameters ◽  
Structural Stress ◽  
Infrared Focal Plane Array ◽  
Indium Bump ◽  
Von Mises

Based on viscoplastic Anand’s model, the structural stress of 8×8 InSb infrared focal plane array (IRFPA) detector is systemically analyzed by finite element method, and the impacts of design parameters including indium bump diameters, heights and InSb chip thicknesses on both von Mises stress and its distribution are discussed in this manuscript. Simulation results show that as the diameters of indium bump decreases from 36 μm to 24 μm in step of 2 μm, the maximum stress existing in InSb chip reduces first, increases then linearly with reduced indium bump diameters, and reaches minimum with indium bump diameter 30 μm, the stress distribution at the contacts areas is uniform and concentrated. Furthermore, the varied tendency has nothing to do with indium bump standoff height. With indium bump diameter 30 μm, as the thickness of InSb chip reduces from 21 μm to 9 μm in step of 3 μm, the varying tendency of the maximum stress value in InSb chip is just like the letter U, as the indium bump thickness decreases also from 21 μm to 6 μm in step of 3 μm, the maximum stress in 8×8 InSb IRPFA decreases from 260 MPa to 102 MPa, which is the smallest von Mises stress value obtained with the indium diameter 30 μm, thickness 9 μm and InSb thickness 12 μm.

scholarly journals Evaluation of Stress Distribution and Force in External Hexagonal Implant: A 3-D Finite Element Analysis

2021 ◽  
Vol 18 (19) ◽  
pp. 10266
Author(s):  
Vinod Bandela ◽  
Ram Basany ◽  
Anil Kumar Nagarajappa ◽  
Sakeenabi Basha ◽  
Saraswathi Kanaparthi ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Distribution ◽  
Maximum Stress ◽  
Axial Direction ◽  
Von Mises Stress ◽  
P Value ◽  
Implant Surface ◽  
Element Analysis ◽  
Von Mises

Purpose: To analyze the stress distribution and the direction of force in external hexagonal implant with crown in three different angulations. Materials and Methods: A total of 60 samples of geometric models were used to analyze von Mises stress and direction of force with 0-, 5-, and 10-degree lingual tilt. Von Mises stress and force distribution were evaluated at nodes of hard bone, and finite element analysis was performed using ANSYS 12.1 software. For calculating stress distribution and force, we categorized and labeled the groups as Implant A1, Implant A2, and Implant A3, and Implant B1, Implant B2, and Implant B3 with 0-, 5-, and 10-degree lingual inclinations, respectively. Inter- and intra-group comparisons were performed using ANOVA test. A p-value of ≤0.05 was considered statistically significant. Results: In all the three models, overall maximum stress was found in implant model A3 on the implant surface (86.61), and minimum was found on model A1 in hard bone (26.21). In all the three models, the direction of force along three planes was maximum in DX (0.01025) and minimum along DZ (0.002) direction with model B1. Conclusion: Maximum von Mises stress and the direction of force in axial direction was found at the maximum with the implant of 10 degrees angulation. Thus, it was evident that tilting of an implant influences the stress concentration and force in external hex implants.

scholarly journals KERUSAKAN DAN PERANCANGAN ULANG ALTERNATIF GIRDER PADA LINTASAN TRIPPER SESUAI SNI 03-1729-2002

2016 ◽  
Vol 17 (3) ◽  
pp. 167
Author(s):  
Djoko W Karmiadji ◽  
Rhandi Mulia ◽  
Eddy Djatmiko
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Maximum Stress ◽  
Von Mises Stress ◽  
Structural Failure ◽  
Element Analysis ◽  
Mechanical Calculation ◽  
Design Alternatives ◽  
Von Mises ◽  
Calculation Analysis

<p>Abstrak<br />Kegagalan fungsi girder pada lintasan tripper yang sering terjadi disebabkan oleh keretakan pada penopang silang dan tegak, terjadinya defleksi berlebih pada batang utama, dan perubahan posisi pada kedua kolom. Kerusakan strukur diakibatkan oleh ketidaksesuaian pembebanan yang diterima, sehingga memperlemah komponennya dan dapat berakibat runtuhnya struktur girder. Studi dilakukan dengan mengkaji desain yang sudah ada melalui pendefenisian pembebanan, selanjutnya melakukan perhitungan mekanika pada tiga model pembebanan yang berbeda dan pengecekan kelayakan desain dengan metode LRFD berdasarkan SNI 03-1729-2002 dengan validasi menggunakan analisis elemen hingga. Hasil menunjukkan terjadinya ketidaksesuaian pembebanan yang berakibat kerusakan girder, sehingga diperlukan desain alternatif melalui pemilihan profil, perhitungan kelayakan profil dan analisis ulang untuk memastikan kehandalan rancangan. Dari hasil analisis perhitungan dapat disimpulkan bahwa desain alternatif mempunyai kehandalan yang memadai yaitu defleksinya 0,35 mm dibanding desain lama 15,96 mm berdasarkan perhitungan mekanik, sedangkan hasil analisis elemen hingga, defleksi desain baru 1,08 mm dan desain lama 10,37 mm. Tegangan maksimum desain baru adalah aman terhadap material yang digunakan, yaitu SS400 dengan kekuatan sebesar 245 MPa, dimana hasil perhitungan mekanika diperoleh tegangan maksimum desain baru 52,00 MPa, sedangkan tegangan maksimum hasil analisis elemen hingga adalah 56,31 MPa dan tegangan Von Mises 143,39 MPa.<br />Kata kunci : girder, tripper, LFRD, elemen hingga, Standar Nasional Indonesia (SNI).</p><p><br />Abstract<br />Malfunction of girder on track tripper that often occurred is caused by cracks in the cross and upright supports, occurrence of excessive deflection on main bar, and a change in position of the both columns. Structural failure is caused by loading discrepancies received, so it is weaken its components and resulted in the collapse of the girder structure. The study was conducted by reviewing existing design through loading analysis, then performing the mechanical calculation on three different loading models and checking the feasibility of the design with LRFD method based on SNI 03-1729-2002 with validation using finite element analysis. Results showed the loading discrepancies resulting in damaged girder, so it is necessary to make design alternatives through the selection of profiles, re-calculation and feasibility analysis of the beam to ensure the reliability of the design. From the calculation analysis, it can be concluded that the alternative design has adequate reliability. Based on mechanical calculations the deflection is 0.35 mm compared to 15.96 mm of the old design, while the result of finite element analysis determine 1.08 mm deflection of the new design and 10.37 mm in old design. The maximum stress of the new design is safe for the material used, ie SS400 with a strength of 245 MPa, wherein mechanical calculation resulted in obtained maximum stress of the new design is 52.00 MPa, while the maximum stress through finite element analysis result is 56.31 MPa and Von Mises stress is 143.39 Mpa.<br />Keywords: girder, tripper, LFRD, finite element, National Indonesian Standard (SNI).</p>

Finite Element Analysis on Structural Stress of Large Format InSb Infrared Focal Plane Array

2010 ◽  
Vol 152-153 ◽  
pp. 1721-1725 ◽  
Author(s):  
Qing Duan Meng ◽  
Qing Song Lin ◽  
Xiao Lei Zhang ◽  
Wei Guo Sun
Keyword(s):  
Finite Element ◽  
Stress Distribution ◽  
Focal Plane ◽  
Focal Plane Array ◽  
Von Mises Stress ◽  
Bottom Surface ◽  
Element Analysis ◽  
Infrared Focal Plane Array ◽  
Indium Bump ◽  
Von Mises

Two-step method is used to research stress and its distribution in 64×64 InSb infrared focal plane array (IRFPA) employing finite element method. First, a small 8×8 InSb IRFPA is studied by changing indium bump diameters from 24μm to 36μm, with indium bump thickness 20μm and InSb thickness 10μm, the simulated results show that von Mises stress in InSb chip is dependent on indium bump diameters, the varying tendency is just like the letter V, here when indium bump diameters is set to 30μm, the smallest von Mises stress is achieved and its distribution in InSb chip is uniform at contacting areas. Then, InSb IRFPA array scale is doubled once again from 8×8 to 64×64 to learn the effect from array size, thus, the stress and its distribution of 64×64 InSb IRFPA is obtained in a short time. Simulation results show that von Mises stress maximum in InSb chip and Si readout integrated circuit almost do not increases with array scale, and the largest von Mises stress is located in InSb chips. Besides, stress distribution on the bottom surface of InSb chip is radiating, and decreases from core to four corners, and stress value at contacting area is smaller than those on its surrounding areas, contrary to stress distribution on top surface of InSb chip.

Finite element analysis of endodontically treated tooth restored with different posts under thermal and mechanical loading

2011 ◽  
Vol 1 (3) ◽  
pp. 75 ◽  
Author(s):  
Ozkan ADIGÜZEL ◽  
Senem YİĞİT ÖZER ◽  
Emrullah BAHŞİ ◽  
İzzet YAVUZ
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Mechanical Loading ◽  
Maximum Stress ◽  
Von Mises Stress ◽  
Stress Concentrations ◽  
Element Analysis ◽  
Endodontically Treated Tooth ◽  
Von Mises ◽  
Titanium Post

Aim: This study compared the stress distributions of endodontically treated tooth restored with carbon and titanium post under thermal and mechanical loading conditions. Methodology: A 3-dimensional finite element model was created to represent in a labiolingual cross-sectional view of an endodontically treated maxillary central incisor tooth with its supporting structures. It was modified according to two post systems with different physical properties consisting titanium, and carbon fiber. Stress distribution and stress values were then calculated by considering the three dimensional von Mises stress criteria. Results: A 100-N static vertical occlusal load was applied on the node at the center of occlusal surface of the tooth. The von Mises stress values for carbon post model was on the coronal third and the cervical area of the root in the range of 436,16 and 3,59 MPa,  for titanium post model was 590,55 and 3,05 MPa. Thermal stress values for carbon post model showed that maximum stress concentrations were noted on the coronal third and the top of the post area of the root in the range of 509,94 and 6,38 MPa. Titanium post model showed that maximum stress concentrations were noted on the coronal third and top of the post area of the root in the range of 1165,06 and 3,06 MPa. Conclusion: This study shows that the titanium post yields larger stresses than the carbon post under thermal conditions.  How to cite this article: Adıgüzel Ö, Yiğit Özer S, Bahşi E, Yavuz İ. Finite element analysis of endodontically treated tooth restored with different posts under thermal and mechanical loading. Int Dent Res 2011;3:75-80. Linguistic Revision: The English in this manuscript has been checked by at least two professional editors, both native speakers of English.

Finite Element Analysis on Structural Stress of 8×8 Infrared Focal Plane Array Integrating with Microlens Arrays

2012 ◽  
Vol 442 ◽  
pp. 162-166
Author(s):  
Li Wen Zhang ◽  
Ming Shao ◽  
Qiang Yu ◽  
Peng Fei Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Focal Plane ◽  
Maximum Stress ◽  
Focal Plane Array ◽  
Structural Stress ◽  
Element Analysis ◽  
Microlens Arrays ◽  
Infrared Focal Plane Array ◽  
Indium Bump

Based on finite element analysis, the structural stress of 8×8 InSb Infrared Focal Plane Array integrating with microlens arrays dependent on indium bump sizes is systemically researched. Simulation results show that as the diameters of indium bump increase from 16μm to 38μm in step of 2μm, the maximum stress existing in InSb chip first reduces, then increases, and reaches minimum with indium bump diameter 32μm. Yet the maximum stress in the indium bump array is almost unchangeable and keeps at 16.5MPa. The maximum stress in Si readout integrated circuit almost half stress in InSb chip. Besides, the stress appearing on those regions situating just on microlens array is much smaller than its surrounding regions, and the stress distribution is uniform at contacting areas between InSb chip and indium bump.

Finite Element Analysis on Structural Stress of 8×8 InSb Infrared Focal Plane Array with Underfill

2011 ◽  
Vol 201-203 ◽  
pp. 108-112
Author(s):  
Qing Duan Meng ◽  
Li Gong Sun ◽  
Jie Xin Pu
Keyword(s):  
Finite Element ◽  
Focal Plane ◽  
Chip Thickness ◽  
Focal Plane Array ◽  
Von Mises Stress ◽  
Structural Stress ◽  
Infrared Focal Plane Array ◽  
Bump Height ◽  
Indium Bump ◽  
Von Mises

Based on viscoplastic Anand’s model, the structural stress of 8×8 InSb infrared focal plane array (IRFPA) detector is systemically analyzed by finite element method, and the impacts of design parameters including indium bump diameters, heights and InSb chip thicknesses on both Von Mises stress and its distribution are discussed in this manuscript. Simulation results show that the maximum stress existing in InSb chip reaches minimum with indium bump diameter 32μm. Under this condition, for the fixed indium height, as the InSb chip thickness reduces from 21µm to 9µm in step of 3µm, Von Mises stress maximum values of InSb chip seems increases gradually, and when the indium bump height reduces from 21µm to 9µm in step of 3µm, its maximum Von Mises stress increase at random increment, do not show certain rules, and indium bump height seems to have a comparable effect on stress value with InSb chip thickness. When indium diameter, height and InSb chip thickness are set to 32µm, 15µm, and 12µm, respectively, the maximal Von Mises value existing in InSb chip reaches minimal value 628MPa, simultaneously the stress distribution at the contacts areas is uniform and concentrated, and this structure is promising to avoid device invalidation.

Finite Element Analysis of Bullet Penetration Circular Sandwich Plate

2013 ◽  
Vol 364 ◽  
pp. 149-153
Author(s):  
Pei Long Zhao ◽  
Fang Zhen Song ◽  
Nai Jian Chen ◽  
Bo Song
Keyword(s):  
Finite Element ◽  
Maximum Stress ◽  
Sandwich Plate ◽  
Time History ◽  
Von Mises Stress ◽  
Maximum Displacement ◽  
Element Analysis ◽  
Circular Sandwich Plate ◽  
Force Time ◽  
Von Mises

A nonlinear dynamic finite element method based on ANSYS/LS-DYNA is used to simulate the physical process of a bullet penetrating circular sandwich plate at a speed of about 400 m/s. In the simulation, Lagrange algorithm, Johnson-Cook and Crushable-foam constitutive model are choosed. Energy time history curve, impact force time history curve, Von-Mises stress nephogram and displacement nephogram are obtained. At the same time, stress time history curve of the maximum stress element and displacement time history curve of the maximum displacement node are obtained. Compared with the non-sandwich plate, it is found that the use of sandwich plate can reduce the total mass, inner plate stress and displacement, and can protect inner plate well.

scholarly journals Finite Element Analysis of Stress in Bone and Abutment-Implant Interface under Static and Cyclic Loadings

2020 ◽  
Author(s):  
Saeed Nokar ◽  
Hamid Jalali ◽  
Farideh Nozari ◽  
Mahnaz Arshad
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Concentration ◽  
Stress Distribution ◽  
Maximum Stress ◽  
Von Mises Stress ◽  
Element Analysis ◽  
Bone Implant ◽  
Factors Affecting ◽  
Von Mises

Objectives: The success of implant treatment depends on many factors affecting the bone-implant, implant-abutment, and abutment-prosthesis interfaces. Stress distribution in bone plays a major role in success/failure of dental implants. This study aimed to assess the pattern of stress distribution in bone and abutment-implant interface under static and cyclic loadings using finite element analysis (FEA). Materials and Methods: In this study, ITI implants (4.1×12 mm) placed at the second premolar site with Synocta abutments and metal-ceramic crowns were simulated using SolidWorks 2007 and ABAQUS software. The bone-implant contact was assumed to be 100%. The abutments were tightened with 35 Ncm preload torque according to the manufacturer’s instructions. Static and cyclic loads were applied in axial (116 Ncm), lingual (18 Ncm), and mesiodistal (24 Ncm) directions. The maximum von Mises stress and strain values ​​were recorded. Results: The maximum stress concentration was at the abutment neck during both static and cyclic loadings. Also, maximum stress concentration was observed in the cortical bone. The loading stress was higher in cyclic than static loading. Conclusion: Within the limitations of this study, it can be concluded that the level of stress in single-unit implant restorations is within the tolerable range by bone.

Effects of occlusal scheme on All-on-Four abutments, screws and prostheses: A three-dimensional finite element study

2020 ◽  
Author(s):  
Nurullah Türker ◽  
Hümeyra Tercanlı Alkış ◽  
Steven J Sadowsky ◽  
Ulviye Şebnem Büyükkaplan
Keyword(s):  
Finite Element ◽  
Three Dimensional ◽  
Good Prognosis ◽  
Von Mises Stress ◽  
Element Analysis ◽  
Group Function ◽  
Occlusal Contact ◽  
Maximum Deformation ◽  
Contact Points ◽  
Von Mises

An ideal occlusal scheme plays an important role in a good prognosis of All-on-Four applications, as it does for other implant therapies, due to the potential impact of occlusal loads on implant prosthetic components. The aim of the present three-dimensional (3D) finite element analysis (FEA) study was to investigate the stresses on abutments, screws and prostheses that are generated by occlusal loads via different occlusal schemes in the All-on-Four concept. Three-dimensional models of the maxilla, mandible, implants, implant substructures and prostheses were designed according to the All-on-Four concept. Forces were applied from the occlusal contact points formed in maximum intercuspation and eccentric movements in canine guidance occlusion (CGO), group function occlusion (GFO) and lingualized occlusion (LO). The von Mises stress values for abutment and screws and deformation values for prostheses were obtained and results were evaluated comparatively. It was observed that the stresses on screws and abutments were more evenly distributed in GFO. Maximum deformation values for prosthesis were observed in the CFO model for lateral movement both in the maxilla and mandible. Within the limits of the present study, GFO may be suggested to reduce stresses on screws, abutments and prostheses in the All-on-Four concept.

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