Formation of Intermetallic Compounds in Friction Bonding of Al Alloys to Steel

2007 ◽  
Vol 539-543 ◽  
pp. 3865-3871 ◽  
Author(s):  
Naotsugu Yamamoto ◽  
Makoto Takahashi ◽  
Masatoshi Aritoshi ◽  
Kenji Ikeuchi
Keyword(s):  
Pure Aluminum ◽  
Close Relation ◽  
Compound Layer ◽  
Al Alloys ◽  
Intermetallic Compound Layer ◽  
Al Alloy ◽  
Mechanical Mixing ◽  
Diffusion Controlled ◽  
Steel Joints ◽  
Kinetics Of

The microstructure of the friction-bonded interface of Al alloys to low C steel has been investigated by TEM observations to reveal the controlling factor of the formation and growth of the IMC (Intermetallic Compound) layer, which caused the premature fracture at the interface even when its thickness was less than 1 μm, as reported in a previous paper. The thickness of the IMC layer observed at the interfaces of Al-Mg alloy/steel and pure-aluminum/steel joints increased almost in proportion to the friction time, but did not obey the parabolic law a characteristic kinetics of the diffusion-controlled process. Analyses of SAD patterns from the IMC layer indicate that it consisted of Fe2Al5, Fe4Al13, (Fe, Mn)Al6 and FeAl2, depending on the alloying elements. These IMCs were granular and distributed almost randomly within the IMC layer, suggesting that mechanical mixing of the steel with the Al alloy occurred at the interface. In the low C steel adjacent to the IMC layer, a zone of much finer grains than those of the base metal was observed. Its width increased with friction time and pressure, and with the growth of the IMC layer, as well. These results suggest that the superficial region of the steel underwent a heavy plastic deformation during the friction process and it had a close relation with the growth of the IMC layer.

Dissimilar Metal Welding of Steel to Al-Mg Alloy by Spot Resistance Welding

2006 ◽  
Vol 15-17 ◽  
pp. 381-386 ◽  
Author(s):  
I.H. Hwang ◽  
Takehiko Watanabe ◽  
Y. Doi
Keyword(s):  
Intermetallic Compound ◽  
Base Metal ◽  
Joint Strength ◽  
Pure Aluminum ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Mg Alloy ◽  
Intermetallic Compound Layer ◽  
Commercially Pure ◽  
Insert Metal

We tried to join steel to Al-Mg alloy using a resistance spot welding method. The effect of Mg in Al-Mg alloy on the strength and the interfacial microstructure of the joint was investigated. Additionally, the effect of insert metal of commercially pure aluminum, which was put into the bonding interface, on the joint strength was examined. The obtained results were as follows. The cross-tensile strength of a joint between SS400 steel and commercially pure aluminum (SS400/Al) was high and fracture occurred in the aluminum base metal. However, the strength of a joint between SS400 and Al-Mg alloy was remarkably low and less than 30% of that of the SS400/Al joint. An intermetallic compound layer developed so thickly at the bonded interface of the SS400/Al-Mg alloy joint that the joint strength decreased. The intermetallic compound layer developed more thickly as Mg content in the Al-Mg alloy increased. Using insert metal of commercially pure aluminum containing little Mg successfully improved the strength of the SS400/Al-Mg alloy joint and the strength was equivalent to that of the base metal.

Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining

2020 ◽  
Vol 307 ◽  
pp. 26-30
Author(s):  
Azman Jalar ◽  
Maria Abu Bakar ◽  
Mohd. Zulhakimi Ab. Razak ◽  
Norliza Ismail
Keyword(s):  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Intermetallic Layer ◽  
Compound Layer ◽  
Effect Of Temperature ◽  
Growth Exponent ◽  
Intermetallic Compound Layer ◽  
Growth Behaviour ◽  
Morphological Effect ◽  
Kinetics Of

Evaluating the growth kinetics is one of the most important characteristic in assessing the quality and reliability of metallurgical joining, especially in electronics packaging such as soldering and wire bonding technology. The growth kinetics is normally assessed using Arrhenius equation that involves diffusion activities due to thermally activated process. The well-known factors of thermal and time together with generally accepted growth exponent have been widely used for this assessment. The intermetallic compound layer which is the by-product of metallurgical reaction during soldering process has been exposed to high temperature to accelerate its growth. The cross-section of the joining was observed using optical microscope to quantify the layer of intermetallic compound. Morphological effect and shape factor of the layer have been analysed in complement with the effect of temperature and time on the growth behaviour. Directional growth and irregularities shape of the intermetallic layer show some inconsistency on the selection of growth exponent. The effect of initial size of intermetallic layer must also be considered in this assessment. This study suggests that the morphological effect must be analysed prior to the selection the growth exponent in assessing growth behaviour and kinetics of intermetallic layer in metallurgical joining.

Effect of Cryorolling Strain on Precipitation Kinetics of Al 7075 Alloy

2008 ◽  
Vol 584-586 ◽  
pp. 911-916 ◽  
Author(s):  
R. Jayaganthan ◽  
Sushanta Kumar Panigrahi
Keyword(s):  
Electron Backscatter Diffraction ◽  
Al Alloys ◽  
Thickness Reduction ◽  
Al Alloy ◽  
Precipitation Kinetics ◽  
Heating Rates ◽  
Ultrafine Grained ◽  
Al 7075 ◽  
7075 Alloy ◽  
Kinetics Of

The effect of rolling strain on precipitation kinetics of Al 7075 alloy processed at liquid nitrogen temperature has been investigated in the present work. The Al 7075 alloy plates were solutionized and cryorolled with thickness reduction of 35% and 90%. The microstructural characterizations of the bulk and cryorolled Al alloy samples were carried out by electron backscatter diffraction analysis (EBSD) and transmission electron microscopy (TEM), respectively. The cryorolled Al alloys upon 90% thickness reduction exhibit ultrafine grained microstructure. The DSC results of cryorolled Al 7075 alloys obtained at different heating rates are used to calculate activation energies for the evolution of precipitates. The influence of different reduction rates on activation energy of precipitate formation in the cryorolled Al 7075 alloys was analyzed. The present study has shown that an ultrafine-grained Al 7075 alloy exhibits a higher driving force for the precipitation formation when compared to that of its bulk Al alloys.

Interfacial Microstructure of Diffusion-Bonded and Annealed Cu-10Fe/Al6061 Clad Material

2012 ◽  
Vol 248 ◽  
pp. 60-65
Author(s):  
Ju Young Jin ◽  
Sun Ig Hong
Keyword(s):  
Diffusion Bonding ◽  
Energy Dispersive Spectrometry ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Intermetallic Compound Layer ◽  
Strengthening Effect ◽  
Layer Formation ◽  
Al 6061 ◽  
Kinetics Of ◽  
Intermetallic Layers

Diffusion bonding between the Cu-10%Fe and Al6061 alloys were successfully achieved at various temperatures (450-525°C) in the argon atmosphere. The bonding interface regions were analyzed using scanning electron microscopy and energy dispersive spectrometry and XRD. The presence of Fe particles in Cu was found to have an influence on the kinetics of intermetallic compound layer formation. Cu-Fe/Al 6061 exhibited the slower growth rate of intermetallic layers than Cu/Al 6061 after diffusion bonding. The movement of Cu-Fe/Cu9Al4 interface into Cu-Fe substrate appears to be hindered by the presence of populated Fe-containing particles and filaments. In addition to Cu9Al4, CuAl and CuAl2 intermetallic layers, Al7Cu2Fe and unreacted Fe were observed to be present in the intermetallic layers. The intermetallic layers which are close to Cu such as Cu9Al4 and CuAl were observed to be harder in Cu-10%Fe/Al 6061 than in Cu/Al 6061, suggesting Fe and its intermetallics have some strengthening effect on Cu9Al4 and CuAl.

Effects of Carbon Content on Intermetallic Compound Layer and Joint Strength in Friction Welding of Al Alloy to Steel

2009 ◽  
Vol 53 (5-6) ◽  
pp. R135-R139 ◽  
Author(s):  
Kenji Ikeuchi ◽  
Makoto Takahashi ◽  
Hiroyuki Watanabe ◽  
Masatoshi Aritoshi
Keyword(s):  
Intermetallic Compound ◽  
Carbon Content ◽  
Friction Welding ◽  
Joint Strength ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Al Alloy

Interfacial Reaction and Strength of Dissimilar Joints of Aluminum Alloys to Steels for Automobile

2005 ◽  
Vol 475-479 ◽  
pp. 349-352 ◽  
Author(s):  
Akio Hirose ◽  
Fumiaki Matsui ◽  
Hirotaka Imaeda ◽  
Kojiro F. Kobayashi
Keyword(s):  
Growth Rate ◽  
Aluminum Alloys ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Diffusion Bonding ◽  
Joint Strength ◽  
Al Alloys ◽  
Al Alloy ◽  
Dissimilar Joints ◽  
Steel Joints

In the present study, we fundamentaly analyzed the interfacial reaction and evaluated the joint strength in dissimilar diffusion bonding of Al alloys to steels. The growth of the reaction layer consisting of FeAl3 and Fe2Al5 intermetallic compounds followed the parabolic growth low. The joints with 5000 series Al alloys had a higher growth rate of the reaction layer than the joints with A6061 Al alloy. The joints of A6061 Al alloy to HT980steel had the lowest growth rate of the reaction layer. The joint strength depended on the thickness of the reaction layer. The A6061 Al alloy/steel joints had the maximum joint strength at around 1µm of average reaction layer thickness.

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