The Preparation and Growth Mechanism of Ni-Coated TiH2 Composite Powder by Electroless Plating
The Ni-coated TiH2composite powder was prepared by electroless plating and the concentration of reducing agent, reaction temperature, reaction time, PH value and so on were optimized by orthogonal experiment design. The Ni/TiH2composite powder morphology and composition was analyzed by scanning electron microscopy (SEM), Energy Dispersive spectroscopy (EDS), X-ray diffraction (XRD); the plated Ni layer growth mechanism was explored preliminary. The Optimization technical parameters: the plating temperature was 85, the pH value was 10 and the hydrazine concentration was 100ml/L. Complete coating and uniform thickness of the Ni layer with average coating thickness about 2.0μm was successfully prepared with the optimization technical parameters. The growth mechanism of the coating followed the Ostwald ripening mechanism. Compared the TiH2uncoated with Ni layers particles, the TiH2composite powder could efficiently delay the starting time of gas release by approximately 80s.