microelectronics fabrication
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Author(s):  
Amandeep Kaur ◽  
Amandeep Kaur

Over last few decades, wireless communication system has sought more attention and plays predominant role in different areas for human personal and commercial applications. Day by day, with advancements in technology, wireless gadgets got more compact due to microelectronics fabrication and integration techniques. So, such applications put great demand over new design specifications on antenna structures used in transmitter and receiver for radio wave communication. In wireless applications depending upon, frequency bands and bandwidth requirements numerous compact antenna structures are used with improved efficiency. Microstrip patch antennas are highly regarded due to its compact size, easy integration with microwave circuits. In study of patch antenna, Defected Ground structures gain popularity these days due to its various benefits to enhance antenna performance. This research article, provides extensive literature survey over use of Defected Ground Structures (DGS) in microstrip patch antenna with its design consequences. This article also explores the enhancement in antenna parameters with implementation of DGS’s. DGS concept is used in microstrip patch antenna and microwave engineering for performance improvement of these devices. DGS can be merged with other techniques to enhance antenna operational parameters like gain, bandwidth, VSWR and spurious radiations.


Author(s):  
Amandeep Kaur ◽  
Amandeep Kaur

Over last few decades, wireless communication system has sought more attention and plays predominant role in different areas for human personal and commercial applications. Day by day, with advancements in technology, wireless gadgets got more compact due to microelectronics fabrication and integration techniques. So, such applications put great demand over new design specifications on antenna structures used in transmitter and receiver for radio wave communication. In wireless applications depending upon, frequency bands and bandwidth requirements numerous compact antenna structures are used with improved efficiency. Microstrip patch antennas are highly regarded due to its compact size, easy integration with microwave circuits. In study of patch antenna, Defected Ground structures gain popularity these days due to its various benefits to enhance antenna performance. This research article, provides extensive literature survey over use of Defected Ground Structures (DGS) in microstrip patch antenna with its design consequences. This article also explores the enhancement in antenna parameters with implementation of DGS’s. DGS concept is used in microstrip patch antenna and microwave engineering for performance improvement of these devices. DGS can be merged with other techniques to enhance antenna operational parameters like gain, bandwidth, VSWR and spurious radiations.


Chemosensors ◽  
2020 ◽  
Vol 8 (3) ◽  
pp. 69
Author(s):  
Janis Hulla ◽  
Vasu Kilaru ◽  
Gregory Doucette ◽  
David Balshaw ◽  
Tim Watkins

The convergence of technological innovations in areas such as microelectronics, fabrication, the Internet-of-things (IoT), and smartphones, along with their associated “apps”, permeates many aspects of life. To that list we now can add environmental monitoring. Once the sole purview of governments and academics in research, this sector is currently experiencing a transformation that is democratizing monitoring with inexpensive, portable commodities available through online retailers. However, as with any emerging area, several challenges and infrastructural hurdles must be addressed before this technology can be fully adopted and its potential be realized. A unique aspect of environmental sensing that differentiates it from some other technology sectors is its strong intersection and overlap with governance, public policy, public health, and national security—all of which contain some element of inherent governmental function. This paper advocates for and addresses the role of sensors in exposure science and illustrates areas in which improved coordination and leveraging of investments by government have helped and would catalyze further development of this technology sector.


2017 ◽  
Vol 50 (42) ◽  
pp. 424001 ◽  
Author(s):  
Ankur Agarwal ◽  
Kallol Bera ◽  
Jason Kenney ◽  
Alexandre Likhanskii ◽  
Shahid Rauf

2017 ◽  
Vol 2017 ◽  
pp. 1-11 ◽  
Author(s):  
Yaakov Mandelbaum ◽  
Ariel Zev ◽  
Avraham Chelly ◽  
Zeev Zalevsky ◽  
Avi Karsenty

A new nanoscale silicon-based modulator has been investigated at different temperatures. In addition to these two advantages, nanoscale dimensions (versus MEMS temperature sensors) and integrated silicon-based material (versus polymers), the third novelty of such optoelectronic device is that it can be activated as a Silicon-On-Insulator Photoactivated Modulator (SOIPAM) or as a Silicon-On-Insulator Thermoactivated Modulator (SOITAM). In this work, static and time dependent temperature effects on the current have been investigated. The aim of the time dependent temperature simulation was to set a temporal pulse and to check, for given dimensions, how much time would it take for the temperature profile and for the change in the electrons’ concentration to come back to the steady state. Assuring that the thermal response is fast enough, the device can be operated as a modulator via thermal stimulation or, on the other hand, can be used as thermal sensor/imager. We present here the design, simulation, and model of the second generation which seems capable of speeding up the processing capabilities. This novel device can serve as a building block towards the development of optical/thermal data processing while breaking through the way to all optic processors based on silicon chips that are fabricated via typical microelectronics fabrication process.


2017 ◽  
Vol 2017 ◽  
pp. 1-9 ◽  
Author(s):  
Yaakov Mandelbaum ◽  
Ilan Gadasi ◽  
Avraham Chelly ◽  
Zeev Zalevsky ◽  
Avi Karsenty

A new nanoscale SOI dual-mode modulator is investigated as a function of optical and thermal activation modes. In order to accurately characterize the device specifications towards its future integration in microelectronics circuitry, current time variations are studied and compared for “large signal” constant temperature changes, as well as for “small signal” fluctuating temperature sources. An equivalent circuit model is presented to define the parameters which are assessed by numerical simulation. Assuring that the thermal response is fast enough, the device can be operated as a modulator via thermal stimulation or, on the other hand, can be used as thermal sensor/imager. We present here the design, simulation, and model of the next generation which seems capable of speeding up the processing capabilities. This novel device can serve as a building block towards the development of optical/thermal data processing while breaking through the way to all optic processors based on silicon chips that are fabricated via typical microelectronics fabrication process.


2015 ◽  
Author(s):  
Scott A. Mathews ◽  
Nicholas A. Charipar ◽  
Ray C. Auyeung ◽  
Heungsoo Kim ◽  
Alberto Piqué

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