conductive polymer composites
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2022 ◽  
Vol 306 ◽  
pp. 130935
Author(s):  
Xiaoyu Chen ◽  
Xuezhong Zhang ◽  
Dong Xiang ◽  
Yuanpeng Wu ◽  
Chunxia Zhao ◽  
...  

Carbon ◽  
2022 ◽  
Vol 186 ◽  
pp. 737
Author(s):  
Ni Wu ◽  
Sai Che ◽  
Hua-wei Li ◽  
Chao-nan Wang ◽  
Xiao-juan Tian ◽  
...  

Author(s):  
Jongyoun Kim ◽  
Hyeonwoo Jung ◽  
Minkyoung Kim ◽  
Hyejeong Bae ◽  
Youngu Lee

2021 ◽  
pp. 153-178
Author(s):  
Zhonglei Li ◽  
Boxue Du ◽  
Yutong Zhao ◽  
Tao Han

2021 ◽  
Vol 2133 (1) ◽  
pp. 012002
Author(s):  
Wei Yang ◽  
Yun Chen ◽  
Yipeng Zhang ◽  
Yongsheng Fu ◽  
Kun Zheng ◽  
...  

Abstract The interfacial thermal conductance (ITC) between filler and polymer matrix is considered as one of the important factors that limits the thermal conductivity of thermally conductive polymer composites. The effect of two different surface treatments (piranha solution and plasma) on ITC of epoxy/alumina was investigated using Time-domain thermoreflectance method (TDTR). The TDTR results show that compared with non-treated samples, the ITC of samples treated by piranha solution and plasma increased 2.9 times and 3.4 times, respectively. This study provides guidance for improving the thermal conductivity of thermally conductive polymer composites.


2021 ◽  
Vol 2080 (1) ◽  
pp. 012008
Author(s):  
Farah Badrul ◽  
Khairul Anwar Abdul Halim ◽  
MohdArif Anuar Mohd Salleh ◽  
Azlin Fazlina Osman ◽  
Nor Asiah Muhamad ◽  
...  

Abstract Low-linear density (LDPE) and copper (Cu) were used as main polymer matrix and conductive filler in order to produce electrically conductive polymer composites (CPC). The selection of the matrix and conductive filler were based on their due to its excellence properties, resistance to corrosion, low cost and electrically conductive. This research works is aimed to establish the effect of compounding parameter on the electrical conductivity of LDPE/Cu composites utilising the design of experiments (DOE). The CPCs was compounded using an internal mixer where all formulations were designed by statistical software. The scanning electron micrograph (SEM) revealed that the Cu conductive filler had a flake-like shape, and the electrical conductivity was found to be increased with increasing filler loading as measured using the four-point probe technique. The conductivity data obtained were then analysed by using the statistical software to establish the relationship between the compounding parameters and electrical conductivity where it was found based that the compounding parameters have had an effect on the conductivity of the CPC.


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