Study on the Effect of Size on InGaN Red Micro-LEDs

In this research, five sizes (100⊆100, 75⊆75, 50⊆50, 25⊆25, 10⊆10 µm2) of InGaN red micro-light emitting diode (LED) dies are produced using laser-based direct writing and maskless technology. It is observed that with increasing injection current, the smaller the size of the micro-LED, the more obvious the blue shift of the emission wavelength. When the injection current is increased from 0.1 to 1 mA, the emission wavelength of the 10×10 µm2 micro-LED is shifted from 617.15 to 576.87 nm. The obvious blue shift is attributed to the stress release and high current density injection. Moreover, the output power density is very similar for smaller chip micro-LEDs at the same injection current density. This behavior is different from AlGaInP micro-LEDs. The sidewall defect is more easily repaired by passivation, which is similar to the behavior of blue micro-LEDs. The results indicate that the red InGaN epilayer structure provides an opportunity to realize the full color LEDs fabricated by GaN-based LEDs.

Investigation of Electrical Properties and Reliability of GaN-Based Micro-LEDs

In this paper, we report high-performance Micro-LEDs on sapphire substrates, with pixel size scaling to 20 µm and an ultra-high current density of 9902 A/cm2. The forward voltages (VF) of the devices ranged from 2.32 V to 2.39 V under an injection current density of 10 A/cm2. The size and structure-dependent effects were subsequently investigated to optimize the device design. The reliability of Micro-LED devices was evaluated under long-aging, high-temperature, and high-humidity conditions. It was found that Micro-LED devices can maintain comparable performance with an emission wavelength of about 445 nm and a full width at half maximum (FWHM) of 22 nm under extreme environments. Following this, specific analysis with four detailed factors of forward voltage, forward current, slope, and leakage current was carried out in order to show the influence of the different environments on different aspects of the devices.

Initiation of Shockley Stacking Fault Expansion in 4H-SiC P-i-N Diodes

To understand the effects of temperature and injection current density on expansion of Shockley stacking faults (SSFs) from basal-plane dislocations in 4H-SiC p-i-n diodes, the threshold current density for SSF expansion was investigated at eight temperatures by electroluminescence image observation. The threshold injection current density was found to decrease at lower temperatures and to increase at higher temperatures. We identified the origin of this temperature dependence and found that the limiting factor for expansion differed depending on the temperature.

Influence of beam radius on deposition parameters in dielectric under high energy electron irradiation

To study the influence of the electron beam radius on the deposition parameters in dielectric under high energy electron irradiation, a model of dielectric irradiated by plane electron beam source was established. Monte Carlo simulation method was used to calculate the distribution of the injection current density, injection charge density, dose rate and radiation induced conductivity in the dielectric layer of Teflon after electron irradiation with different energies and different beam radii. The results show that the radius of the electron beam source has little influence on the distribution trend of the injection current density in the dielectric layer, as well as the peak position of the injection charge density and the dose rate, but it will significantly affect the peak value of injection charge density and the dose rate. When the electron beam radius is smaller than the dielectric layer radius, the calculated peak is higher than that of the electron beam completely covering the dielectric layer. The higher the electron energy is, the greater the relative deviation will be.

InGaAsP variable optical attenuator with lateral P-I-N junction formed by Ni-InGaAsP and Zn diffusion on III-V on insulator wafer

ABSTRACTIn this study, we successfully demonstrate a carrier-injection InGaAsP variable optical attenuator (VOA) with a lateral P-I-N junction formed by Ni-InGaAsP alloy and Zn diffusion on a III-V on insulator (III-V-OI) wafer. The Ni-InGaAsP alloy for the n+ junction is formed by direct reaction between Ni and InGaAsP after annealing at 350°C. The p+ junction is formed by the Zn diffusion at 500°C using Zn doped spin-on glass (SOG). By both techniques, we successfully reduce the sheet and contact resistivity in the lateral P-I-N junction even with the relatively low-temperature process as compared with the P-I-N junction formed by conventional Si and Be ion implantation. By injecting carriers into the InGaAsP waveguide through the lateral P-I-N junction, we achieve the optical attenuation of -40 dB/mm with an injection current density of 40 mA/mm at a 1.55 μm wavelength.

Feasibility of spoof surface plasmon waveguide enabled ultrathin room temperature THz GaN quantum cascade laser

We propose and study the feasibility of a THz GaN/AlGaN quantum cascade laser (QCL) consisting of only five periods with confinement provided by a spoof surface plasmon (SSP) waveguide for room temperature operation. The QCL design takes advantages of the large optical phonon energy and the ultrafast phonon scattering in GaN that allow for engineering favorable laser state lifetimes, and the SSP waveguide provides the optical confinement for the ultrathin QCL. Our analysis has shown that the waveguide loss is sufficiently low for the QCL to reach its threshold at the injection current density around 6 kA/cm2 at room temperature.

15 kV, Large Area (1 cm2), 4H-SiC p-Type Gate Turn-Off Thyristors

In this paper, we report our recently developed 1 cm2, 15 kV SiC p-GTO with an extremely low differential on-resistance (RON,diff) of 4.08 mΩ•cm2 at a high injection-current density (JAK) of 600 ~ 710 A/cm2. The 15 kV SiC p-GTO was built on a 120 μm, 2×1014/cm3 doped p-type SiC drift layer with a device active area of 0.521 cm2. Forward conduction of the 15 kV SiC p-GTO was characterized at 20°C and 200°C. Over this temperature range, the RON,diff at JAK of 600 ~ 710 A/cm2 decreased from 4.08 mΩ•cm2 at 20°C to 3.45 mΩ•cm2 at JAK of 600 ~ 680 A/cm2 at 200°C. The gate to cathode blocking voltage (VGK) was measured using a customized high-voltage test set-up. The leakage current at a VGK of 15 kV were measured 0.25 µA and 0.41 µA at 20°C and 200°C respectively.

16 kV, 1 cm2, 4H-SiC PiN Diodes for Advanced High-Power and High-Temperature Applications

In this work, we report our recently developed 16 kV, 1 cm2, 4H-SiC PiN diode results. The SiC PiN diode was built on a 120 µm, 2×1014/cm3 doped n-type SiC drift layer with a device active area of 0.5175 cm2. Forward conduction of the PiN diode was characterized at temperatures from 20°C to 200°C. At high injection-current density (JF) of 350 ~ 400 A/cm2, the differential on-resistance (RON,diff) of the SiC PiN diode decreased from 6.08 mΩ·cm2 at 20°C to 5.12 mΩ·cm2 at 200°C, resulting in a very small average temperature coefficient of –5.33 µΩ·cm2/°C, while the forward voltage drop (VF) at 100 A/cm2 reduced from 4.77 V at 20°C to 4.17 V at 200°C. This is due to an increasing high-level carrier lifetime with an increase in temperature, resulting in reduced forward voltage drop. We also observed lower RON,diff at higher injection-current densities, suggesting that a higher carrier lifetime is needed in this lightly doped n-type SiC thick epi-layer in order to achieve full conductivity modulation. The anode to cathode reverse blocking leakage current was measured as 0.9 µA at 16 kV at room temperature.