2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications

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Published By IEEE

9781538665923

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Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680900 ◽

2018 ◽

Author(s):

Surender Singh ◽

Ashish Gupta

Keyword(s):

Signal Integrity ◽

High Density ◽

Next Generation ◽

Integrity Analysis

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Non-Periodic Flipped-SIR EBG for Dual-Band SSN Mitigation in 2-Layer PCB

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680868 ◽

2018 ◽

Cited By ~ 1

Author(s):

Yu-Cong Wang ◽

Hao-Wei Chan ◽

Hsin-Chan Hsieh ◽

Ying-Hsi Lin ◽

Wen-Shan Wang ◽

...

Keyword(s):

Dual Band

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A novel on-chip mismatch measurement technique for Nyquist rate ADCs

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680875 ◽

2018 ◽

Author(s):

Ankur BAL ◽

Vikram SINGH

Keyword(s):

Measurement Technique ◽

Nyquist Rate ◽

On Chip

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Phase Change Material Compact Model: Validation and Sensitivity as Thermal Interface Material

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680873 ◽

2018 ◽

Author(s):

Javed Shaikh ◽

Je-Young Chang ◽

Weihua Tang

Keyword(s):

Phase Change ◽

Phase Change Material ◽

Model Validation ◽

Thermal Interface Material ◽

Compact Model ◽

Thermal Interface ◽

Change Material

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Paper [Program]

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680859 ◽

2018 ◽

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Preliminary Application of Deep Learning to Design Space Exploration

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680888 ◽

2018 ◽

Cited By ~ 2

Author(s):

Kallol Roy ◽

Hakki Torun Mert ◽

Madhavan Swaminathan

Keyword(s):

Deep Learning ◽

Design Space Exploration ◽

Design Space ◽

Space Exploration ◽

Preliminary Application

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A Methodology for distributed Co-design and Coextraction of Die Re-distribution Layer and Package

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680894 ◽

2018 ◽

Author(s):

Ashish Gupta ◽

Abhishek Bhattacharya ◽

Vansh Mohan ◽

Ayush Singh ◽

Ritabrata Bhattacharya ◽

...

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Power Delivery Network Optimization In High Speed BGA Package

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680891 ◽

2018 ◽

Author(s):

Rohit Mishra ◽

Zakir Hussain ◽

Ramanand S Hegde

Keyword(s):

Network Optimization ◽

High Speed ◽

Power Delivery ◽

Power Delivery Network ◽

Bga Package ◽

Delivery Network

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Extension of EMPSIJ for Estimating the Impact of Substrate Noise on Jitter in a CMOS Inverter

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680885 ◽

2018 ◽

Cited By ~ 1

Author(s):

Vijender Kumar Sharma ◽

Jai Narayan Tripathi ◽

Hitesh Shrimali

Keyword(s):

Substrate Noise ◽

Cmos Inverter ◽

The Impact

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Preeminent Buffer Insertion Technique For Long Advanced On-Chip Graphene Interconnects

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680882 ◽

2018 ◽

Cited By ~ 2

Author(s):

Takshashila Pathade ◽

Urmi Shah ◽

Yash Agrawal ◽

Rutu Parekh

Keyword(s):

Buffer Insertion ◽

Insertion Technique ◽

On Chip

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2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications

Non-Periodic Flipped-SIR EBG for Dual-Band SSN Mitigation in 2-Layer PCB

A novel on-chip mismatch measurement technique for Nyquist rate ADCs

Phase Change Material Compact Model: Validation and Sensitivity as Thermal Interface Material

Paper [Program]

Preliminary Application of Deep Learning to Design Space Exploration

A Methodology for distributed Co-design and Coextraction of Die Re-distribution Layer and Package

Power Delivery Network Optimization In High Speed BGA Package

Extension of EMPSIJ for Estimating the Impact of Substrate Noise on Jitter in a CMOS Inverter

Preeminent Buffer Insertion Technique For Long Advanced On-Chip Graphene Interconnects

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications