EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Numerical modeling of two proposed mechanically fabricated free-fins heatsinks

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938506 ◽

2009 ◽

Cited By ~ 1

Author(s):

Jan Bijan Pourian ◽

Mark Irwin ◽

Erik Dahlquist

Keyword(s):

Numerical Modeling

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Investigation on the loading of thermomechanical actuators to improve efficient thermomechanical reduction bases for fast reanalysis

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938489 ◽

2009 ◽

Author(s):

Alexander M. Steenhoek ◽

Daniel J. Rixen

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Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938435 ◽

2009 ◽

Cited By ~ 2

Author(s):

D. Farley ◽

Y. Zhou ◽

F. Askari ◽

M. Al-Bassyiouni ◽

A. Dasgupta ◽

...

Keyword(s):

High Density ◽

Mechanical Cycling

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Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938466 ◽

2009 ◽

Author(s):

Masafumi Sano ◽

Chan-Yen Chou ◽

Tuan-Yu Hung ◽

Shin-Yueh Yang ◽

Kuo-Ning Chiang

Keyword(s):

Reliability Analysis ◽

Drop Test ◽

Chip Scale Package ◽

Board Level

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Optimising dynamic behaviour of electrostatically actuated MEMS contact switch

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938463 ◽

2009 ◽

Cited By ~ 3

Author(s):

Maryna Lishchynska ◽

Marcin Cychowski ◽

Niel Canty ◽

Tom O'Mahony ◽

Kieran Delaney

Keyword(s):

Dynamic Behaviour ◽

Electrostatically Actuated ◽

Contact Switch

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Effect of wire bond and die layout on electrical performance of power packages

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938434 ◽

2009 ◽

Author(s):

Yumin Liu ◽

Mark Rembrandt T. Carredo ◽

Zhiping Hu ◽

Yong Liu ◽

Timwah Luk ◽

...

Keyword(s):

Electrical Performance ◽

Wire Bond

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Drop test simulation study of flexible devices

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938425 ◽

2009 ◽

Author(s):

Quayle Chen ◽

Leon Xu ◽

Cherie Jing ◽

Tom Xue ◽

Bin Wang ◽

...

Keyword(s):

Simulation Study ◽

Drop Test ◽

Flexible Devices

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System-level modeling and simulation of a frequency-tunable electrostatic energy harvester

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938485 ◽

2009 ◽

Cited By ~ 2

Author(s):

D. Hohlfeld ◽

S. Matova ◽

R. van Schaijk

Keyword(s):

Modeling And Simulation ◽

Energy Harvester ◽

System Level ◽

Electrostatic Energy ◽

System Level Modeling ◽

Frequency Tunable

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Co-design and multi-physics analysis for power electronic modules

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938505 ◽

2009 ◽

Cited By ~ 1

Author(s):

C. Bailey ◽

H. Lu ◽

T. Tilford ◽

J. Rizvi ◽

C. Yin

Keyword(s):

Power Electronic

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Pull-in curves determined with monolithic FEM models

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2009.4938406 ◽

2009 ◽

Cited By ~ 1

Author(s):

Stephan D.A. Hannot ◽

Daniel J. Rixen

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EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Numerical modeling of two proposed mechanically fabricated free-fins heatsinks

Investigation on the loading of thermomechanical actuators to improve efficient thermomechanical reduction bases for fast reanalysis

Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs

Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test

Optimising dynamic behaviour of electrostatically actuated MEMS contact switch

Effect of wire bond and die layout on electrical performance of power packages

Drop test simulation study of flexible devices

System-level modeling and simulation of a frequency-tunable electrostatic energy harvester

Co-design and multi-physics analysis for power electronic modules

Pull-in curves determined with monolithic FEM models

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EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and MicrosystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Numerical modeling of two proposed mechanically fabricated free-fins heatsinks

Investigation on the loading of thermomechanical actuators to improve efficient thermomechanical reduction bases for fast reanalysis

Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs

Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test

Optimising dynamic behaviour of electrostatically actuated MEMS contact switch

Effect of wire bond and die layout on electrical performance of power packages

Drop test simulation study of flexible devices

System-level modeling and simulation of a frequency-tunable electrostatic energy harvester

Co-design and multi-physics analysis for power electronic modules

Pull-in curves determined with monolithic FEM models

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications