Economics of materials in mobile phone preprocessing, focus on non-printed circuit board materials

2019 ◽  
Vol 87 ◽  
pp. 78-85 ◽  
Author(s):  
Weitong Liu ◽  
Patrick Ford ◽  
Hugo Uvegi ◽  
Fernanda Margarido ◽  
Eduardo Santos ◽  
...  
Keyword(s):  
Mobile Phone ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Magnetic Emission Mapping for Passive Integrated Components Characterisation

2003 ◽  
Author(s):  
O. Crépel ◽  
Y. Bouttement ◽  
P. Descamps ◽  
C. Goupil ◽  
P. Perdu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Mobile Phone ◽  
Printed Circuit Board ◽  
Magnetic Sensors ◽  
Circuit Board ◽  
Magnetic Disturbance ◽  
Passive Components ◽  
Printed Circuit ◽  
Integrated Inductor ◽  
The Magnetic Field

Abstract We developed a system and a method to characterize the magnetic field induced by circuit board and electronic component, especially integrated inductor, with magnetic sensors. The different magnetic sensors are presented and several applications using this method are discussed. Particularly, in several semiconductor applications (e.g. Mobile phone), active dies are integrated with passive components. To minimize magnetic disturbance, arbitrary margin distances are used. We present a system to characterize precisely the magnetic emission to insure that the margin is sufficient and to reduce the size of the printed circuit board.

Comparison of Leaching Processes of Gold and Copper from Printed Circuit Boards of Waste Mobile Phone

2014 ◽  
Vol 955-959 ◽  
pp. 2743-2746 ◽  
Author(s):  
Jian Feng Yin ◽  
Si Hui Zhan ◽  
He Xu
Keyword(s):  
Mobile Phone ◽  
Inductively Coupled Plasma ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Precious Metals ◽  
Optical Emission ◽  
Optimal Choice ◽  
Circuit Board ◽  
Printed Circuit

Waste mobile phone has become the largest number of electronic waste, and recycling of metals from mobile phone would ensure resource recycling and reduce environmental degradation. Based on the contents of metals analyzed by Inductively Coupled Plasma Optical Emission Spectrometer (ICP-OES), containing copper and precious metals such as gold, the paper compared the extraction processes of gold, copper from waste mobile phone printed circuit board (PCB). In this study, two processes, nitric acid and thiourea (NT), sulfuric acid-hydrogen peroxide and iodine (SAHPI) were used to leach copper and gold, respectively. The recovery rate of copper was found to be 96.42%, and 94.3% of the gold was leached in the former process. Similar trends were obtained for the leaching of copper and gold in the latter process, but it was lower that about 95.27% of copper was recycled, while 93.4% of gold were leached. Both the two processes were nontoxic and non-cyanide system. However, thiourea is not stable and easy to decompose in alkaline solution, and the technology has disadvantage of instability. Iodine leaching on the other hand is comparatively a environmental process. Therefore, the optimal choice is the combined process of SAHPI method, while further research is required to develop cost effective and environmentally friendly processes.

Microstructure of Solder Joint Interconnect in Used Mobile Phone

2006 ◽  
Vol 517 ◽  
pp. 123-128
Author(s):  
Shahrul Nizam Shahdan ◽  
Azman Jalar ◽  
Muhammad Azmi Abd Hamid
Keyword(s):  
Solder Joint ◽  
Mobile Phone ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Void Formation ◽  
Circuit Board ◽  
Electronic Package ◽  
X Ray ◽  
Printed Circuit ◽  
Tin Content

A tin-lead solder is generally used to mount an electronic package on to a printed circuit board (PCB) of an electronic devices. In this study, we investigated the microstructure of the solder joint from a four years old used mobile phone. Microstructure and morphology of the joint was obtained using optical and scanning electron microscopy (OM and SEM) respectively. Cracks and voids can clearly be seen in the solder area for the most of the sample observed. Crack up to 10 μm wide appeared to be propagating along the solder line between Cu lead and Cu substrate. Energy dispersive X-ray (EDX) analysis revealed that cracks occurred at the richer tin content. It was not clear the exact mechanism that leads to the existence of the crack. However we believe that thermomechanical cause such as thermal fatigue, void formation and the thicker layer of intermetallic compound contributed to the failure of the solder joint.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

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