scholarly journals Laser transmission welding as an assembling process for high temperature electronic packaging

Author(s):  
M. Villar ◽  
F. Chabert ◽  
C. Garnier ◽  
V. Nassiet ◽  
J. C. Diez ◽  
...  
2016 ◽  
Vol 57 (7) ◽  
pp. 1209-1214 ◽  
Author(s):  
Myong-Hoon Roh ◽  
Hiroshi Nishikawa ◽  
Seiichiro Tsutsumi ◽  
Naruhiko Nishiwaki ◽  
Keiichi Ito ◽  
...  

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000214-000221
Author(s):  
Bob Hunt

This paper presents the development and qualification of high temperature electronic module packaging technology to service the requirements for extended and reliable operation at 225°C (437°F) for applications in the Oil & Gas, Automotive and Aerospace markets. It also covers the application of this technology to the first in a range of DC-DC converter modules and is based on Cissoid's ‘ETNA’ semiconductor components.


2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000111-000115
Author(s):  
Piers R. Tremlett

A polymer based electronic packaging system has been developed that is capable of operating at temperatures over 175°C and up to 225°C. This system is being developed to be a lead free, non-hermetic and able to deliver miniature or functionally dense circuits. It will be suitable for sensor systems where amplification, signal digitisation and autonomy are important whilst operating in a harsh environment such as high temperature.


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