Oxidation-resistant Cu-Ag Core-shell Nanoparticle Paste for High Temperature Electronic Packaging
Keyword(s):
Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content
2020 ◽
Vol 10
(10)
◽
pp. 1604-1610
2016 ◽
Vol 57
(7)
◽
pp. 1209-1214
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2011 ◽
Vol 1
(4)
◽
pp. 479-485
◽
2015 ◽
Vol 22
(4)
◽
pp. 1-5
◽
2019 ◽
Keyword(s):