Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules

2020 ◽  
Author(s):  
Alexander Klemm ◽  
Michael Schmidt ◽  
Martin Rittner ◽  
Michael Guyenot ◽  
Manfred Reinold ◽  
...  
Keyword(s):  
Temperature Cycling ◽  
Power Modules ◽  
Inductive Power

Embedded Die Packages and Modules for Power Electronics Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001918-001947 ◽  
Author(s):  
Lars Boettcher ◽  
S. Karaszkiewicz ◽  
D. Manessis ◽  
A. Ostmann
Keyword(s):  
Power Electronics ◽  
Power Efficiency ◽  
High Reliability ◽  
Heat Removal ◽  
Testing Temperature ◽  
Temperature Cycling ◽  
Switching Frequency ◽  
Large Area ◽  
Power Modules ◽  
Embedded Power

Packages and modules with embedded semiconductor dies are of interest for various application fields and power classes. First packages in the lower power range are available in volume production since almost six years. Recent developments focus on medium and higher power applications raging over 500W into the kW range. Different approaches are available to realize such packages and modules. This paper will give an overview and detailed description of the latest approaches for such embedded die structures. In common of all of these approaches, is the use of laminate based die embedding, which uses standard PCB manufacturing technologies. Main differences are the used base substrate, which can still be a ceramic (DBC), Cu leadframe or high current substrate. Examples for the different methods will be given. As the main part, this paper will describe concepts, which enable significant smaller form-factor of power electronics modules, thereby allowing for lower price, high reliability, capability of direct mounting on e.g. a motor so as to form one unit with the motor housing, wide switching frequency range (for large application field) and high power efficiency. The innovative character of this packaging concept is the idea to embed the power drive components (IGBTs, MOSFETs, diode) as thinned chips into epoxy-resin layer built-up and to realize large-area interconnections on both sides by direct copper plating the dies to form a conductor structure with lowest possible electrical impedance and to achieve an optimum heat removal. In this way a thin core is formed on a large panel format which is called Embedded Power Core. The paper will specifically highlight the first results on manufacturing an embedded power discrete package as an example of an embedded power core containing a thin rectifier diode. For module realization, the power cores are interconnected to insulated metal substrates (IMS) by the use of Ag sintering interconnection technologies for the final manufacturing of Power modules. The paper will elaborate on the sintering process for Power Core/IMS interconnections, the microscopically features of the sintered interfaces, and the lateral filling of the sintering gap with epoxy prepregs. Firstly, 500W power modules were manufactured using this approach. Reliability testing results, solder reflow testing, temperature cycling test and active power cycling, will be discussed in detail.

Module-Level TIM Degradation in HALT

2021 ◽  
Author(s):  
Joshua Tompkins ◽  
David Huitink
Keyword(s):  
Thermal Resistance ◽  
Random Vibration ◽  
Temperature Cycling ◽  
Thermal Dissipation ◽  
Peak Acceleration ◽  
Maintenance Schedule ◽  
Testing Method ◽  
Power Modules ◽  
Initial Characterization ◽  
Useful Lifetime

Abstract In this study, TIM degradation is driven through HALT using temperature cycling and random vibration for two commercially available materials providing thermal conductivities of 6.5 and 8.0 W/m-K. HALT specimen were prepared by applying TIM through a 4-mil stencil over AlSiC baseplates in the shape of those used in Wolfspeed CAS325M12HM2 power electronics modules. Baseplates were mounted onto aluminum carrier blocks with embedded thermocouples to characterize the thermal resistance across the baseplate and TIM layer. Thermal dissipation into the top of the baseplates was provided by a custom heating block, which mimics the size and placement of the die junctions in CAS325 modules, applying power loads of 200, 300, and 400W. After initial characterization, samples were transferred to the HALT chamber with one set of samples exposed to temperature cycling only (TCO) and the other temperature cycling and vibration (TCV). Both sample sets were cycled between temperature extremes of −40 and 180 °C with random vibrations applied at a peak acceleration of 3.21 Grms. After hundreds of cycles, samples were reevaluated to assess changes in thermal resistance to provide an accelerated measure of TIM degradation. This will allow for reliability calculations of useful lifetime, provide a basis for developing accelerated testing method to related temperature cycling to faster methods of degradation, and additionally provide a means by which to develop a maintenance schedule for servicing the power modules which will enhance cooling and lifetime operation.

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

Large-area Substrate Bonding with Single-printing Silver Paste Sintering for Power Modules

2020 ◽  
pp. 1-1
Author(s):  
Hong-Yu Zhang ◽  
Xin Li ◽  
Han-Ning Jiang ◽  
Yun-Hui Mei ◽  
Guo-Quan Lu
Keyword(s):  
Large Area ◽  
Silver Paste ◽  
Power Modules

Thermal Evaluation of an Inductive Power Transfer Pad for Charging Electric Vehicles

2021 ◽  
pp. 1-1
Author(s):  
Seho Kim ◽  
Maedeh Amirapour ◽  
Tharindu Dharmakeerthi ◽  
Vahid Zahiri Barsari ◽  
Grant A. Covic ◽  
...  
Keyword(s):  
Electric Vehicles ◽  
Power Transfer ◽  
Inductive Power Transfer ◽  
Inductive Power
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