scholarly journals Investigation into voltage and process variation-aware manufacturing test

2011 ◽  
Author(s):  
Urban Ingelsson ◽  
Bashir M. Al-Hashimi
Keyword(s):  
Process Variation ◽  
Manufacturing Test

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

Enabling Wavelength-Dependent Adjoint-Based Methods for Process Variation Sensitivity Analysis in Silicon Photonics

2020 ◽  
pp. 1-1
Author(s):  
Zhengxing Zhang ◽  
Sally I. El-Henawy ◽  
Allan Sadun ◽  
Ryan Miller ◽  
Luca Daniel ◽  
...  
Keyword(s):  
Sensitivity Analysis ◽  
Silicon Photonics ◽  
Process Variation

LOOKUP TABLE-BASED ADAPTIVE BODY BIASING OF MULTIPLE MACROS FOR PROCESS VARIATION COMPENSATION AND LOW LEAKAGE

2010 ◽  
Vol 19 (07) ◽  
pp. 1449-1464 ◽  
Author(s):  
BYUNGHEE CHOI ◽  
YOUNGSOO SHIN
Keyword(s):  
Supply Voltage ◽  
Process Variation ◽  
Power Saving ◽  
Lookup Table ◽  
Low Leakage ◽  
Fine Grain ◽  
Body Biasing ◽  
Block Level ◽  
Adaptive Body Bias ◽  
Body Bias

A reduced supply voltage must be accompanied by a reduced threshold voltage, which makes this approach to power saving susceptible to process variation in transistor parameters, as well as resulting in increased subthreshold leakage. While adaptive body biasing is efficient for both compensating process variation and suppressing leakage current, it suffers from a large overhead of control circuit. Most body biasing circuits target an entire chip, which causes excessive leakage of some blocks and misses the chance of fine grain control. We propose a new adaptive body biasing scheme, based on a lookup table for independent control of multiple functional blocks on a chip, which controls leakage and also compensates for process variation at the block level. An adaptive body bias is applied to blocks in active mode and a large reverse body bias is applied to blocks in standby mode. This is achieved by a central body bias controller, which has a low overhead in terms of area, delay, and power consumption. The problem of optimizing the required set of bias voltages is formulated and solved. A design methodology for semicustom design using standard-cell elements is developed and verified with benchmark circuits.

Flexible TFT Circuit Analyzer Considering Process Variation, Aging, and Bending Effects

2014 ◽  
Vol 10 (1) ◽  
pp. 19-27 ◽  
Author(s):  
En-Hua Ma ◽  
Wen-En Wei ◽  
Hung-Yi Li ◽  
James Chien-Mo Li ◽  
I-Chun Cheng ◽  
...  
Keyword(s):  
Process Variation ◽  
Circuit Analyzer
Sign in / Sign up

Export Citation Format

Share Document