A Novel Low Power Technique for FinFET Domino OR Logic

Excessive scaling of complementary metal oxide semiconductor (CMOS) technology is the main reason of large power dissipation in electronic circuits. Very large-scale integration (VLSI) industry has chosen an alternative option known as fin-shaped field effect transistor (FinFET) technology to mitigate the large power dissipation. FinFET is a multi-gate transistor which dissipates less leakage power as compared to CMOS transistors, but it does not completely resolve the problem of power dissipation. So, leakage reduction approaches are always required to mitigate the impact of power dissipation. In this paper, cascaded leakage control transistors (CLCT) leakage reduction technique is proposed using FinFET transistors. CLCT approach is tested for basic static logic circuits like inverter, 2-input NAND and NOR gates and compared with the existing leakage reduction techniques for leakage power dissipation and delay calculations at 16 and 14 nm technology nodes using Cadence tools. CLCT approach shows the effective reduction of leakage power with minimum delay penalty. As the domino logic gates are widely used in large memories and high-speed processors therefore, CLCT approach is further utilized for footless domino logic (FLDL) and compared with the available methods at 14[Formula: see text]nm technology node. CLCT approach reduces 35.16% power dissipation as compared to the conventional domino OR logic. Temperature and multiple parallel fin variations are estimated for the domino OR logic to check its reliable operation. CLCT approach has high-noise tolerance capability in term of unity noise gain (UNG) for domino OR logic as compared to the other methods.