scholarly journals Design of Energy Efficient Control Unit and Implementation on High Performance FPGA

2019 ◽  
Vol 8 (12S2) ◽  
pp. 23-26
Keyword(s):  
Power Consumption ◽  
Energy Efficient ◽  
Field Programmable Gate Array ◽  
High Performance ◽  
Control Unit ◽  
Input Output ◽  
Green Communication ◽  
Power Efficient ◽  
Efficient Control ◽  
Field Programmable

With the crisis of power across the globe, green communication and power-efficient devices are getting more and more attention. This work emphasis about the implementation of Control Unit (CU) circuit on FPGA kit. In this project, power consumption of CU circuit is analyzed by changing the different Input/Output (I/O) standards of FPGA. This project is implemented on Xilinx 14.1 tool and the power consumption on CU is calculated with X Power Analyzer tool on 28-Nano-Meter (nm) Artix-7 Field Programmable Gate Array (FPGA). Out of different I/O standards, CU circuit is most power efficient with LVCMOS I/O standard on Artix-7 FPGA.

scholarly journals Design of Energy Efficient Control Unit and Implementation on High Performance FPGA

2019 ◽  
Vol 8 (12S2) ◽  
pp. 23-26
Keyword(s):  
Power Consumption ◽  
Energy Efficient ◽  
Field Programmable Gate Array ◽  
High Performance ◽  
Control Unit ◽  
Input Output ◽  
Green Communication ◽  
Power Efficient ◽  
Efficient Control ◽  
Field Programmable

With the crisis of power across the globe, green communication and power-efficient devices are getting more and more attention. This work emphasis about the implementation of Control Unit (CU) circuit on FPGA kit. In this project, power consumption of CU circuit is analyzed by changing the different Input/Output (I/O) standards of FPGA. This project is implemented on Xilinx 14.1 tool and the power consumption on CU is calculated with X Power Analyzer tool on 28-Nano-Meter (nm) Artix-7 Field Programmable Gate Array (FPGA). Out of different I/O standards, CU circuit is most power efficient with LVCMOS I/O standard on Artix-7 FPGA

scholarly journals Power Efficient Frequency Scaled and Thermal-Aware Control Unit Design on FPGA

2019 ◽  
Vol 8 (9S2) ◽  
pp. 530-533
Keyword(s):  
Power Consumption ◽  
Energy Efficient ◽  
Field Programmable Gate Array ◽  
Control Unit ◽  
Processing Unit ◽  
Power Efficient ◽  
Central Processing ◽  
Unit Design ◽  
Efficient Control ◽  
Field Programmable

These works describe the implementation of a control unit which is an important part of Central Processing Unit (CPU) with the Field Programmable Gate Array (FPGA). In this work a frequency scaled and thermal aware energy-efficient control unit is designed with the help of 28 nanometer (nm) technology based FPGA. Frequency varies from 100MHz to 5GHz and the rise in frequency also gives rise in power consumption of control unit with FPGA. The thermal properties of FPGA also increase with increment in frequency. This whole experiment is done on Xilinx 14.1 ISE Design Suit and it is observed that lower the frequency, lower will be the power consumption of FPGA.

scholarly journals Implementation of Power-Efficient Control Unit on Ultra-scale FPGA for Green Communication

2021 ◽  
Vol 10 (1) ◽  
pp. 93-105
Author(s):  
Bishwajeet Pandey ◽  
Keshav Kumar ◽  
Aiza Batool ◽  
Shabeer Ahmad
Keyword(s):  
Control Unit ◽  
Green Communication ◽  
Power Efficient ◽  
Efficient Control

scholarly journals VLSI Implementation of Green Computing Control Unit on Zynq FPGA for Green Communication

2021 ◽  
Vol 2021 ◽  
pp. 1-10
Author(s):  
Anurag Shrivastava ◽  
Ali Rizwan ◽  
Neelam Sanjeev Kumar ◽  
R. Saravanakumar ◽  
Inderjit Singh Dhanoa ◽  
...  
Keyword(s):  
Power Consumption ◽  
Control Unit ◽  
Total Power ◽  
Processing Unit ◽  
Clock Frequency ◽  
Green Communication ◽  
Green Networking ◽  
Power Efficient ◽  
Total Power Consumption ◽  
5 Ghz

The issue of the energy shortage is affecting the entire planet. This is occurring because of massive population and industry growth around the world. As a result, the entire world is attempting to implement green networking systems and manufacture the power/energy efficient products. This research work discusses the green networking system technologies. This work introduces a power-efficient control unit (CU) design and implemented on the Zynq SoC (System on Chip) ultrascale field programmable gate array (FPGA). The VIVADO HLx Design Suite is used to simulate and analyze the CU model which is considered as one of the key components of central processing unit (CPU), used for data communication purposes. The CU is made suitable for the green communication by making it power-efficient. Therefore, the power consumption of the CU is analyzed for the various set frequency value ranging between 100 MHz and 5 GHz, and it is discovered that as the clock frequency rises up, the total power consumption also tends to get increased. The total power of the proposed model is reduced by 77.42%, 21.29%, and 17.93% from three models, respectively, being compared in the present paper. Final results shows that the CU is better suited to run at low frequencies to optimize power consumption.

scholarly journals Ultracompact and low-power-consumption silicon thermo-optic switch for high-speed data

Nanophotonics ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 937-945
Author(s):  
Ruihuan Zhang ◽  
Yu He ◽  
Yong Zhang ◽  
Shaohua An ◽  
Qingming Zhu ◽  
...  
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
High Performance ◽  
Pulse Amplitude ◽  
Telecommunication Networks ◽  
Low Power Consumption ◽  
Power Efficient ◽  
High Speed Data ◽  
On Chip

AbstractUltracompact and low-power-consumption optical switches are desired for high-performance telecommunication networks and data centers. Here, we demonstrate an on-chip power-efficient 2 × 2 thermo-optic switch unit by using a suspended photonic crystal nanobeam structure. A submilliwatt switching power of 0.15 mW is obtained with a tuning efficiency of 7.71 nm/mW in a compact footprint of 60 μm × 16 μm. The bandwidth of the switch is properly designed for a four-level pulse amplitude modulation signal with a 124 Gb/s raw data rate. To the best of our knowledge, the proposed switch is the most power-efficient resonator-based thermo-optic switch unit with the highest tuning efficiency and data ever reported.

scholarly journals High speed multi-channel data acquisition technique for efficient hardware utilization using quad data rate approach

2018 ◽  
Vol 7 (4) ◽  
pp. 2569
Author(s):  
Priyanka Chauhan ◽  
Dippal Israni ◽  
Karan Jasani ◽  
Ashwin Makwana
Keyword(s):  
Power Consumption ◽  
Data Acquisition ◽  
Resource Utilization ◽  
Field Programmable Gate Array ◽  
High Speed ◽  
State Of The Art ◽  
Data Rate ◽  
Field Programmable ◽  
Sensor Signals ◽  
Acquisition Technique

Data acquisition is the most demanding application for the acquisition and monitoring of various sensor signals. The data received are processed in real-time environment. This paper proposes a novel Data Acquisition (DAQ) technique for better resource utilization with less power consumption. Present work has designed and compared advanced Quad Data Rate (QDR) technique with traditional Dual Data Rate (DDR) technique in terms of resource utilization and power consumption of Field Programmable Gate Array (FPGA) hardware. Xilinx ISE is used to verify results of FPGA resource utilization by QDR with state of the art DDR approach. The paper ratiocinates that QDR technique outperforms traditional DDR technique in terms of FPGA resource utilization.  

scholarly journals VLSI implementation of Wallace Tree Multiplier using Ladner-Fischer Adder

2021 ◽  
Vol 14 (1) ◽  
pp. 22-31
Author(s):  
Kommalapati Monica ◽  
◽  
Dereddy Anuradha ◽  
Syed Rasheed ◽  
Barnala Shereesha ◽  
...  
Keyword(s):  
Power Consumption ◽  
Field Programmable Gate Array ◽  
Finite Impulse Response ◽  
Research Work ◽  
Industrial Applications ◽  
Booth Multiplier ◽  
Wallace Tree ◽  
Look Up Table ◽  
Field Programmable ◽  
Wallace Tree Multiplier

Nowadays, most of the application depends on arithmetic designs such as an adder, multiplier, divider, etc. Among that, multipliers are very essential for designing industrial applications such as Finite Impulse Response, Fast Fourier Transform, Discrete cosine transform, etc. In the conventional methods, different kind of multipliers such as array multiplier, booth multiplier, bough Wooley multiplier, etc. are used. These existing multipliers are occupied more area to operate. In this study, Wallace Tree Multiplier (WTM) is implemented to overcome this problem. Two kinds of multipliers have designed in this research work for comparison. At first, existing WTM is designed with normal full adders and half adders. Next, proposed WTM is designed using Ladner Fischer Adder (LFA) to improve the hardware utilization and reduce the power consumption. Field Programmable Gate Array (FPGA) performances such as slice Look Up Table (LUT), Slice Register, Bonded Input-Output Bios (IOB) and power consumption are evaluated. The proposed WTM-LFA architecture occupied 374 slice LUT, 193 slice register, 59 bonded IOB, and 26.31W power. These FPGA performances are improved compared to conventional multipliers such asModified Retiming Serial Multiplier (MRSM), Digit Based Montgomery Multiplier (DBMM), and Fast Parallel Decimal Multiplier (FPDM).

Challenges in 3D Inspection of Micro Bumps Used in 3D Packaging

2012 ◽  
Vol 2012 (1) ◽  
pp. 000542-000547 ◽  
Author(s):  
Reza Asgari
Keyword(s):  
Power Consumption ◽  
Wafer Bonding ◽  
Field Programmable Gate Array ◽  
Laser Triangulation ◽  
3D Measurement ◽  
Lower Power ◽  
Small Pitch ◽  
Field Programmable ◽  
3D Packaging ◽  
2D And 3D

2.5D/3D devices are the next major packaging technologies, driven by the need for more functionality, lower power consumption and smaller footprint. Many device manufacturers are devoting capital to develop their own processes and some are already shipping devices such as FPGA (Field Programmable Gate Array) on interposers. 3D packages often require hundreds of thousands of I/O per die. Micro Pillar bumps and C4 bumps are the main bump geometries used in 3D packages as their small pitch and size allow the required number of I/Os. Inspecting these bumps throughout the process is critical because failure after chip to chip or chip to wafer bonding is very costly. This paper describes the use of a camera and laser triangulation to provide complete 2D and 3D measurement and inspection capability.

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