Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

2011 ◽  
Vol 2011 (1) ◽  
pp. 000341-000344 ◽  
Author(s):  
Cheryl Tulkoff ◽  
Greg Caswell
Keyword(s):  
Failure Analysis ◽  
New Technologies ◽  
High Reliability ◽  
Electronics Industry ◽  
Physics Of Failure ◽  
Bga Packages ◽  
Long Life ◽  
Robust Manufacturing

Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row of leads and small lead counts. However, there is currently a proliferation of advanced LNCSP package styles that have started to approach BGA packages in terms of both size and number of connections. Some of the newer packages have 3 or more rows, pitches as fine as .35mm, lead counts exceeding 200, and dimensions exceeding 12 mm × 12 mm. While the advantages of these packages are well documented, concerns arise with both reliability and manufacturability in Pb-free environments. So, acceptance of these packages in long-life, severe-environment, high-reliability applications is somewhat limited. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies like LNCSP. Since robust manufacturing and qualifications standards always lag behind implementation, users must carefully select and validate these components for suitability in their use environments and customer applications. Soldering, flexure, and cleanliness issues have driven many failures seen in production and in the field. All of these areas must be addressed early in the selection and validation processes. In this paper, we will review and discuss LNCSP related reliability concerns and challenges, and propose Physics-of- Failure (PoF) based approaches to allow the successful introduction and failure analysis of LNCSP components in electronics products.

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

Layout Overlay Techniques to Improve Failure Analysis

1998 ◽  
Author(s):  
Christian Burmer ◽  
Siegfried Görlich ◽  
Siegfried Pauthner
Keyword(s):  
Failure Analysis ◽  
Focused Ion Beam ◽  
New Technologies ◽  
Ion Beam ◽  
Image Correlation ◽  
Microelectronic Devices ◽  
Overlay Technique ◽  
Correlation Techniques ◽  
Navigation Software ◽  
Image Format

Abstract New layout overlay technique has been developed based on standard image correlation techniques to support failure analysis in modern microelectronic devices, which are critical to analyze because they are realized in new technologies using sub-ìm design rules, chemical mechanical polishing techniques (CMP) and autorouted design techniques. As the new technique is realized as an extension of a standard CAD-navigation software and as it makes use of standard image format "TIFF" for data input, which is available at all modern equipments for failure analysis, these technique can be applied to all modern failure analysis methods. Here examples are given for three areas of application: circuit modification using Focused Ion Beam (FIB), support of preparation for backside inspection and fault localization using emission microscopy.

Case Study—Failure Analysis of a Multiplexer

2016 ◽  
Author(s):  
Michael Woo ◽  
Marcos Campos ◽  
Luigi Aranda
Keyword(s):  
Failure Analysis ◽  
High Reliability ◽  
Component Failure ◽  
Root Cause ◽  
Knowing That ◽  
Cause Of Failure ◽  
The Cost

Abstract A component failure has the potential to significantly impact the cost, manufacturing schedule, and/or the perceived reliability of a system, especially if the root cause of the failure is not known. A failure analysis is often key to mitigating the effects of a componentlevel failure to a customer or a system; minimizing schedule slips, minimizing related accrued costs to the customer, and allowing for the completion of the system with confidence that the reliability of the product had not been compromised. This case study will show how a detailed and systemic failure analysis was able to determine the exact cause of failure of a multiplexer in a high-reliability system, which allowed the manufacturer to confidently proceed with production knowing that the failure was not a systemic issue, but rather that it was a random “one time” event.

Electronic Package Failure Analysis Using TDR

2000 ◽  
Author(s):  
Dima A. Smolyansky
Keyword(s):  
Failure Analysis ◽  
Fault Location ◽  
Measurement Accuracy ◽  
Time Domain Reflectometry ◽  
Acoustic Imaging ◽  
X Ray ◽  
Analysis Techniques ◽  
Bga Packages ◽  
Impedance Profile ◽  
Nature Of Time

Abstract The visual nature of Time Domain Reflectometry (TDR) makes it a very natural technology that can assist with fault location in BGA packages, which typically have complex interweaving layouts that make standard failure analysis techniques, such as acoustic imaging and X-ray, less effective and more difficult to utilize. This article discusses the use of TDR for package failure analysis work. It analyzes in detail the TDR impedance deconvolution algorithm as applicable to electronic packaging fault location work, focusing on the opportunities that impedance deconvolution and the resulting true impedance profile opens up for such work. The article examines the TDR measurement accuracy and the comparative package failure analysis, and presents three main considerations for package failure analysis. It also touches upon the goal and the task of the failure analysts and TDR's specific signatures for the open and short connections.

New Rapid Failure Analysis Techniques for Multilevel Metallization

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 74-77
Author(s):  
Edward I. Cole ◽  
Richard E. Anderson
Keyword(s):  
Integrated Circuits ◽  
Product Development ◽  
Failure Analysis ◽  
New Product Development ◽  
New Product ◽  
Electronics Industry ◽  
New Techniques ◽  
Analysis Techniques ◽  
Advantages And Disadvantages ◽  
Failure Site

Open interconnections on integrated circuits (ICs) are a serious and ubiquitous problem throughout the micro-electronics industry. The efforts to understand the mechanisms responsible for producing open interconnections and to develop analytical methods to localize them demonstrate the concern manufacturers have for this problem. Multiple layers of metallization not only increase the probability that an open conductor or via will occur because of the increased number of interconnections and vias but also increase the difficulty in localizing the site of the failure because upper layers may mask the failure site.Rapid failure analysis of open-conductor defects is critical in new product development and reliability assessment of ICs where manufacturing and product development delays can cost millions of dollars a day. In this article, we briefly review some standard failure analysis approaches and then concentrate on new techniques to rapidly locate open-conductor defects that would have been difficult or impossible to identify using earlier methods. Each method is described in terms of the physics of signal generation, application, and advantages and disadvantages when compared to existing methods.

Practical long-life spark gaps for high-reliability applications

2002 ◽  
Author(s):  
R.F. Caristi ◽  
J.B. Roy ◽  
R.L. Brooks ◽  
A.J. Pennell
Keyword(s):  
High Reliability ◽  
Long Life

Impact of Technology Infusion on System Complexity and Modularity

2015 ◽  
Author(s):  
GwangKi Min ◽  
Eun Suk Suh ◽  
Katja Hölttä-Otto
Keyword(s):  
System Performance ◽  
New Technologies ◽  
Life Cycles ◽  
System Complexity ◽  
Host System ◽  
Technology Infusion ◽  
Long Life ◽  
Impact Of Technology ◽  
The Impact ◽  
Over Time

Complex systems often have long life cycles with requirements that are likely to change over time. Therefore, it is important to be able to adapt the system accordingly over time. This is often accomplished by infusing new technologies into the host system in order to update or improve overall system performance. However, technology infusion often results in a disruption in the host system. This can take the form of a system redesign or a change in the inherent attributes of the system. In this study, we analyzed the impact of technology infusion on system attributes, specifically the complexity and modularity. Two different systems that were infused with new technologies were analyzed for changes in complexity and modularity.

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