Development of a cooling system for 6U module based on Elbrus microprocessor

The article discusses the design features of cooling systems for compact Eurocard format modules based on the Elbrus microprocessor. The issue of ensuring the necessary thermal regime of the processor module in the space shortage conditions in order to accommodate the cooling system has been solved. The estimated calculation showed the underperformance of the passive cooling of the Elbrus-4S microprocessor with a heat output of 60 W. In this regard, a 3D model of an active cooling system with 5.5×10.3×4.6 cm dimensions was developed. Thermal calculations were performed using the SolidWorks Flow Simulation program in order to optimize the radiator geometry and fan speed. It was assumed that an optimized cooling system will ensure that the chip temperature of the Elbrus-4S processor is no more than +87 °C (at an ambient temperature of +55 °C). Based on the results of the study, three prototypes were produced for testing. Further tests conducted on prototypes showed the efficiency of the cooling system and the high accuracy of the simulation results. During tests in a climatic chamber at a temperature of +55 °C, the temperature on the microprocessor chip did not exceed +84 °C (a difference of 3 °C compared to the estimated one).

A Ring Oscillator Based Random Generator for Cryptography Applications

A ring oscillator based Random number generator (RNG) for Cryptography applications is presented. The paper explains about the requirements and generation of high randomness based codes, used to improve the security in data communication. The methodology used is sampling technique, adopted in the oscillator for the random number generation. To get better randomness in the output bits of RNG, a processor module based on Linear feedback shift register is used. The proposed RNG is designed with bit rate is 100kb/s, with a power consumption of 37µw. After implementation in hardware, this can be used for cryptography encryption applications to enhance the security. The system is simulated and synthesized with Xilinx ISE and the results are compared with the existing system based on randomness, power consumption, etc.

METHODS FOR STACK ARCHITECTURE HARDWARE-COMPUTING DEVELOPMENT FOR HARSH ENVIRONMENT OF OPERATION

The article contains materials on the most common industrial standards for the design of components and heterogeneous hardwarecomputing platforms of four architectures that define the requirements and methods for connecting the main components of the platform to each other. The new proposed method for designing protected hardware-computing platforms of the new StackPC architecture is considered in detail. The main advantages of the new app manufacturability roach and the scope of its application are described. Described new functionality that has become available for the stack architecture due to the introduction of the new high-speed StackPC-FPE stack connector, the stackable power connector and the definition of stack expansion in one direction (up from the processor module) to the standard. The trends in the development of the standard have been determined. A comparison of the new method with existing methods is presented. It is shown that the implementation of the proposed method allows the design of new modern platforms with preservation of the required indices of resistance to harsh operating conditions, as well as to increase manufacturability, productivity and expand the functionality.

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

When contemplating processor module cooling, the notion of maximum cooling capability is not simple or straight forward to estimate. There are a multitude of variables and constraints to consider; some more rigid or fixed than others. This paper proposes a theoretical maximum cooling capability predicated on the treatment of the module heat sink or cold plate as a heat exchanger with infinite conductive and convective behavior. The resulting theoretical minimum heat sink thermal resistance is a function of the bulk thermal transport of the fluid dependent only on the fluid’s density, specific heat (at constant pressure) and volumetric flow rate. An ideal module internal thermal resistance will also be defined. The sum of the two resistances constitutes the theoretical minimum total module thermal resistance and defines the ideal thermal performance of the module. Finally, a module cooling effectiveness relating the actual module thermal performance to the ideal thermal performance will defined. Examples of both air and water cooled modules will be given with discussion on the relevance and utility of this methodology.

Design of Wireless Sensor System for Agricultural Micro Environment Based on WiFi

The Implementation of microenvironment monitoring system in network for greenhouse is based on the agricultural greenhouse micro environment and combined with wireless sensor network technology. Information is received by the sensors in the front system with the parameters such as temperature, humidity, light and carbon dioxide. the sensor signal acquisition and A/D conversion is controlled by the processor module which is also the controller of the WiFi wireless module. Wireless router relay communication enlarging the monitoring area is used in the system design. The communication between the terminal nodes and the monitoring center and a series of process like data collecting, processing, transmitting and displaying are all controlled by software. The system has the benefits of networking quick and easy, stable operation, good extension and low power consumption, and it can meet the needs of the micro environment measurement and control system.